Assignee
CHANDRASEKARAN ARVIND
US·13 granted patents·2 pending applications·309 citations·filing 2008–2012
Top patents by PatentIndex Score
15 records- 0198US8525342B2Dual-side interconnected CMOS for stacked integrated circuitsCHANDRASEKARAN ARVIND·Filed 2010·Granted Sep 3, 2013·248 cites·15 claims
- 0286US8557680B2Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafersCHANDRASEKARAN ARVIND·Filed 2012·Granted Oct 15, 2013·7 cites·20 claims
- 0386US8242543B2Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafersCHANDRASEKARAN ARVIND·Filed 2009·Granted Aug 14, 2012·12 cites·9 claims
- 0481US8451581B2Passive coupler between package substrate and system boardCHANDRASEKARAN ARVIND·Filed 2010·Granted May 28, 2013·6 cites·18 claims
- 0581US8310061B2Stacked die parallel plate capacitorCHANDRASEKARAN ARVIND·Filed 2008·Granted Nov 13, 2012·10 cites·25 claims
- 0679US8076762B2Variable feature interface that induces a balanced stress to prevent thin die warpageCHANDRASEKARAN ARVIND·Filed 2009·Granted Dec 13, 2011·8 cites·20 claims
- 0778US8283776B2Microfabricated pillar fins for thermal managementCHANDRASEKARAN ARVIND·Filed 2010·Granted Oct 9, 2012·4 cites·20 claims
- 0875US9252128B2Panelized backside processing for thin semiconductorsCHANDRASEKARAN ARVIND·Filed 2011·Granted Feb 2, 2016·3 cites·17 claims
- 0973US8445994B2Discontinuous thin semiconductor wafer surface featuresCHANDRASEKARAN ARVIND·Filed 2009·Granted May 21, 2013·3 cites·17 claims
- 1071US8294280B2Panelized backside processing for thin semiconductorsCHANDRASEKARAN ARVIND·Filed 2009·Granted Oct 23, 2012·4 cites·7 claims
- 1170US8391018B2Semiconductor die-based packaging interconnectCHANDRASEKARAN ARVIND·Filed 2009·Granted Mar 5, 2013·4 cites·16 claims
- 1252US8877563B2Microfabricated pillar fins for thermal managementCHANDRASEKARAN ARVIND·Filed 2012·Granted Nov 4, 2014·0 cites·18 claims
- 1349US8482125B2Conductive sidewall for microbumpsCHANDRASEKARAN ARVIND·Filed 2010·Granted Jul 9, 2013·0 cites·6 claims
- 1438US2012012991A1Integrated shielding for a package-on-package systemCHANDRASEKARAN ARVIND·Filed 2010·Application pending·0 cites
- 1537US2012025362A1Reinforced Wafer-Level Molding to Reduce WarpageCHANDRASEKARAN ARVIND·Filed 2010·Application pending·0 cites
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