Inventor · disambiguated record
Lei Zhuang
Also filed as: ZHUANG LEI · ZHUANG LEI L
17 granted patents·12 pending applications·348 citations·filing 1999–2024
91Inventor score
Top patents by PatentIndex Score
29 records- 0198US6713238B1Microscale patterning and articles formed therebyFiled 1999·Granted Mar 30, 2004·323 cites·22 claims
- 0291US9799660B1Stable and reliable FinFET SRAM with improved beta ratioGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 24, 2017·7 cites·11 claims
- 0389US9418935B1Integrated circuit line ends formed using additive processingGLOBALFOUNDRIES INC·Filed 2015·Granted Aug 16, 2016·7 cites·20 claims
- 0486US9812324B1Methods to control fin tip placementGLOBALFOUNDRIES INC·Filed 2017·Granted Nov 7, 2017·4 cites·14 claims
- 0577US9245788B2Non-bridging contact via structures in proximityTSENG CHIAHSUN·Filed 2012·Granted Jan 26, 2016·3 cites·13 claims
- 0671US8796812B2Self-aligned trench over finTSENG CHIAHSUN·Filed 2012·Granted Aug 5, 2014·2 cites·20 claims
- 0769US9899183B1Structure and method to measure focus-dependent pattern shift in integrated circuit imagingGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 20, 2018·1 cites·20 claims
- 0867US9076733B2Self-aligned trench over finIBM·Filed 2014·Granted Jul 7, 2015·1 cites·9 claims
- 0965US11469146B2Methods of performing fin cut etch processes for FinFET semiconductor devicesGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 11, 2022·0 cites·9 claims
- 1061US2025318238A1Via-to-backside power rail structureIBM·Filed 2024·Application pending·0 cites
- 1160US2025285975A1Enhanced power rail connectionIBM·Filed 2024·Application pending·0 cites
- 1260US2025204026A1Semiconductor device with lateral diodes and stacked fetsIBM·Filed 2023·Application pending·0 cites
- 1358US10217696B2Non-bridging contact via structures in proximityIBM·Filed 2017·Granted Feb 26, 2019·0 cites·10 claims
- 1458US2025194161A1Backside signal contact and power formation for stacked transistorsIBM·Filed 2023·Application pending·0 cites
- 1558US2025006664A1Three dimensional mechanically bolting staple fillIBM·Filed 2023·Application pending·0 cites
- 1658US2025006663A1Double-sided integrated circuit with electrostatic guard ringIBM·Filed 2023·Application pending·0 cites
- 1758US2025107059A1Gate metal jumper in stacked fet sramIBM·Filed 2023·Application pending·0 cites
- 1858US2025006629A1Double-sided integrated circuit with damage sensorIBM·Filed 2023·Application pending·0 cites
- 1958US2025006590A1Double-sided integrated circuit with stabilizing cageIBM·Filed 2023·Application pending·0 cites
- 2057US2009084492A1Microscale patterning and articles formed therebyUNIV PRINCETON·Filed 2008·Application pending·0 cites
- 2154US10916478B2Methods of performing fin cut etch processes for FinFET semiconductor devicesGLOBALFOUNDRIES US INC·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 2254US9941191B2Non-bridging contact via structures in proximityIBM·Filed 2015·Granted Apr 10, 2018·0 cites·18 claims
- 2353US10366996B2Stable and reliable FinFET SRAM with improved beta ratioGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 30, 2019·0 cites·9 claims
- 2446US2023322499A1Device and method for separating materialsABB SCHWEIZ AG·Filed 2020·Application pending·0 cites
- 2545US11905921B2Main beam for wind turbine blade and manufacturing method thereofENVISION ENERGY CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·13 claims
- 2645US10768521B2Extreme ultraviolet (EUV) mask absorber and method for forming the sameGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 8, 2020·0 cites·9 claims
- 2744US7482057B2Microscale patterning and articles formed therebyUNIV PRINCETON·Filed 2003·Granted Jan 27, 2009·0 cites·8 claims
- 2841US2002042027A1Microscale patterning and articles formed therebyFiled 2001·Application pending·0 cites
- 2938US11035712B2Metering system for calculating real-time profit or loss of gas stationsJIANGYIN FUREN HIGH TECH CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →