Inventor · disambiguated record
Craig Bercaw
Also filed as: BERCAW CRAIG · BERCAW CRAIG A · BERCAW CRAIG ALAN
26 granted patents·7 pending applications·2,355 citations·filing 1990–2006
97Inventor score
Top patents by PatentIndex Score
33 records- 0199US7153542B2Assembly line processing methodTEGAL CORP·Filed 2002·Granted Dec 26, 2006·650 cites·27 claims
- 0299US5531835APatterned susceptor to reduce electrostatic force in a CVD chamberAPPLIED MATERIALS INC·Filed 1994·Granted Jul 2, 1996·852 cites·6 claims
- 0397US5680013ACeramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfacesAPPLIED MATERIALS INC·Filed 1994·Granted Oct 21, 1997·177 cites·30 claims
- 0496US5069938AMethod of forming a corrosion-resistant protective coating on aluminum substrateAPPLIED MATERIALS INC·Filed 1990·Granted Dec 3, 1991·157 cites·22 claims
- 0593US5959409ACeramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method protecting such heated metal surfacesAPPLIED MATERIALS INC·Filed 1997·Granted Sep 28, 1999·81 cites·33 claims
- 0692US7442615B2Semiconductor processing system and methodTEGAL CORP·Filed 2006·Granted Oct 28, 2008·18 cites·20 claims
- 0791US6572706B1Integrated precursor delivery systemSIMPLUS SYSTEMS CORP·Filed 2000·Granted Jun 3, 2003·39 cites·16 claims
- 0890US5496142ASlotted conical spring washerAPPLIED MATERIALS INC·Filed 1993·Granted Mar 5, 1996·75 cites·23 claims
- 0988US7867905B2System and method for semiconductor processingTEGAL CORP·Filed 2006·Granted Jan 11, 2011·13 cites·20 claims
- 1086US6610169B2Semiconductor processing system and methodSIMPLUS SYSTEMS CORP·Filed 2001·Granted Aug 26, 2003·29 cites·17 claims
- 1179US6221166B1Multi-thermal zone shielding apparatusSIMPLUS SYSTEMS CORP·Filed 2000·Granted Apr 24, 2001·18 cites·11 claims
- 1278US5705225AMethod of filling pores in anodized aluminum partsAPPLIED MATERIALS INC·Filed 1996·Granted Jan 6, 1998·33 cites·2 claims
- 1377US5811195ACorrosion-resistant aluminum article for semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 1995·Granted Sep 22, 1998·49 cites·33 claims
- 1476US6858085B1Two-compartment chamber for sequential processingTEGAL CORP·Filed 2002·Granted Feb 22, 2005·18 cites·34 claims
- 1574US5756222ACorrosion-resistant aluminum article for semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 1994·Granted May 26, 1998·49 cites·29 claims
- 1667US5192610ACorrosion-resistant protective coating on aluminum substrate and method of forming sameAPPLIED MATERIALS INC·Filed 1990·Granted Mar 9, 1993·25 cites·20 claims
- 1759US6921555B2Method and system for sequential processing in a two-compartment chamberTEGAL CORP·Filed 2002·Granted Jul 26, 2005·6 cites·35 claims
- 1857US6800254B1Visual indicator cold trapping systemTEGAL CORP·Filed 2000·Granted Oct 5, 2004·6 cites·33 claims
- 1955US7049549B2Multi-thermal zone shielding apparatusTEGAL CORP·Filed 2004·Granted May 23, 2006·3 cites·20 claims
- 2054US6844527B2Multi-thermal zone shielding apparatusTEGAL CORP·Filed 2001·Granted Jan 18, 2005·3 cites·7 claims
- 2151US7074278B2Removable lid and floating pivotTEGAL CORP·Filed 2003·Granted Jul 11, 2006·2 cites·15 claims
- 2251US6609632B2Removable lid and floating pivotSIMPLUS SYSTEMS CORP·Filed 2001·Granted Aug 26, 2003·2 cites·12 claims
- 2350US6242111B1Anodized aluminum susceptor for forming integrated circuit structures and method of making anodized aluminum susceptorAPPLIED MATERIALS INC·Filed 1993·Granted Jun 5, 2001·20 cites·48 claims
- 2448US6123097AApparatus and methods for controlling process chamber pressureAPPLIED MATERIALS INC·Filed 1996·Granted Sep 26, 2000·13 cites·17 claims
- 2547US6449844B2Heat exchanger apparatus for a semiconductor wafer support and method of fabricating sameAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·3 cites·8 claims
- 2647US2003196603A1Integrated precursor delivery systemFiled 2003·Application pending·0 cites
- 2746US6180926B1Heat exchanger apparatus for a semiconductor wafer support and method of fabricating sameAPPLIED MATERIALS INC·Filed 1998·Granted Jan 30, 2001·14 cites·11 claims
- 2846US2007022959A1Deposition apparatus for semiconductor processingBERCAW CRAIG·Filed 2006·Application pending·0 cites
- 2944US2007028838A1Gas manifold valve clusterBERCAW CRAIG·Filed 2006·Application pending·0 cites
- 3042US2005037597A1Semiconductor processing system and methodFiled 2003·Application pending·0 cites
- 3140US2002062789A1Apparatus and method for multi-layer depositionFiled 2000·Application pending·0 cites
- 3238US2004058293A1Assembly line processing systemFiled 2002·Application pending·0 cites
- 3336US2006051506A1Nitridation of high-k dielectricsSENZAKI YOSHIHIDE·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Craig Bercaw files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →