Inventor · disambiguated record
Cheng-Fan Lin
Also filed as: LIN CHENG · LIN CHENG-FAN
8 granted patents·7 pending applications·31 citations·filing 2006–2023
82Inventor score
Files withCHIPBOND TECHNOLOGY CORP6SHIH CHENG-HUNG4RITDISPLAY CORP2ENTIRE TECHNOLOGY CO LTD1KUO CHIH-MING1
Top patents by PatentIndex Score
15 records- 0190US8501614B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Aug 6, 2013·16 cites·7 claims
- 0277US8530344B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Sep 10, 2013·5 cites·7 claims
- 0373US8497579B1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Jul 30, 2013·4 cites·7 claims
- 0467US12224734B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·8 claims
- 0567US7954983B2Optical component, manufacturing method of the same and backlight moduleENTIRE TECHNOLOGY CO LTD·Filed 2009·Granted Jun 7, 2011·4 cites·10 claims
- 0662US7564183B2Organic electroluminescent display panel with dummy areasRITDISPLAY CORP·Filed 2006·Granted Jul 21, 2009·2 cites·43 claims
- 0757US11522517B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Dec 6, 2022·0 cites·7 claims
- 0851US2024105664A1Package structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0947US2013256882A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1047US2013249089A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1145US2013252374A1Semiconductor packaging method and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1242US8425067B2Composite diffuser structure and backlight moduleLIN CHENG·Filed 2009·Granted Apr 23, 2013·0 cites·18 claims
- 1338US2009091241A1Full-color organic light-emitting diode display panel and fabricating method thereofRITDISPLAY CORP·Filed 2007·Application pending·0 cites
- 1435US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 1535US2013214419A1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →