Inventor · disambiguated record
Hyo Seung Nam
Also filed as: NAM HYO SEUNG
3 granted patents·19 pending applications·18 citations·filing 2007–2015
63Inventor score
Top patents by PatentIndex Score
22 records- 0191US7879153B1Method for cleaning metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 1, 2011·13 cites·13 claims
- 0277US10045436B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 7, 2018·5 cites·3 claims
- 0353US2010006446A1Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0450US2015373833A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0550US2010031775A1Method for preparing nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0649US2007199735A1Printed circuit board having inner via hole and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0748US2013140074A1Via hole plating method and printed circuit board manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0848US2009029258A1Preparing method of tin sulfide nanoparticles and manufacturing method of lithium ion battery using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0947US9235129B2Composition for photoresist development and method of developing photoresist using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·16 claims
- 1047US2014076618A1Method of forming gold thin film and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1147US2014069805A1Electro-copper plating apparatusSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1246US2014069816A1Nickel plating solution and method for forming nickel plating layer using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1345US2011135811A1Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1445US2014166355A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1545US2014099433A1Basket jig for electroless plating apparatus and electroless plating methodSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1643US2015107880A1Multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1742US2015156860A1Solder resist opening structure and circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1841US2012123574A1Plating method of substrate and manufacturing method of circuit board using the sameMOON JEONG-HO·Filed 2011·Application pending·0 cites
- 1938US2011241709A1Apparatus and method for measuring activity of plating solutionSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2037US2012031550A1Method for forming a plating layer and method for manufacturing a circuit board using the sameMOON JEONG-HO·Filed 2011·Application pending·0 cites
- 2134US2015195902A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2234US2015342054A1Embedded coreless substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →