Electro-copper plating apparatus

Abstract

Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-copper plating apparatus including: a main bath including a cathode, an insoluble anode, and a plating solution; and a dissolution bath including a copper ball, and manganese oxide. According to the present invention, the manganese oxide having higher oxidation-reduction potential instead of using Fe 3+ of the related art as the copper source in the electro-copper plating apparatus may be used to obtain a high effect in suppressing surface plating even at a low concentration.

What is claimed is: 
     
         1 . An electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide. 
     
     
         2 . The electro-copper plating apparatus according to  claim 1 , wherein the manganese oxide is KMnO 4  or NaMnO 4 . 
     
     
         3 . The electro-copper plating apparatus according to  claim 1 , wherein the manganese oxide is included in a concentration of 0.1 to 10 g/L. 
     
     
         4 . The electro-copper plating apparatus according to  claim 1 , wherein the plating solution includes copper sulfate in a concentration of 50 to 350 g/L, sulfuric acid in a concentration of 10 to 150 g/L, and chlorine in a concentration of 10 to 200 mg/L. 
     
     
         5 . The electro-copper plating apparatus according to  claim 1 , wherein the insoluble anode is made of titanium (Ti) coated with platinum (Pt) or IrO 2 . 
     
     
         6 . An electro-copper plating apparatus comprising:
 a main bath including a cathode, an insoluble anode, and a plating solution; and   a dissolution bath including a copper ball, and manganese oxide.   
     
     
         7 . The electro-copper plating apparatus according to  claim 6 , wherein the copper is supplied from the dissolution bath to the plating solution of the main bath by dissolving the copper to be a copper ion through a reaction of manganese oxide and the copper ball of the dissolution bath. 
     
     
         8 . The electro-copper plating apparatus according to  claim 6 , wherein the manganese oxide is KMnO 4  or NaMnO 4 . 
     
     
         9 . The electro-copper plating apparatus according to  claim 6 , wherein the manganese oxide is included in a concentration of 0.1 to 10 g/L. 
     
     
         10 . The electro-copper plating apparatus according to  claim 6 , wherein the plating solution of the electro-copper plating apparatus includes copper sulfate in a concentration of 50 to 350 g/L, sulfuric acid in a concentration of 10 to 150 g/L, and chlorine in a concentration of 10 to 200 mg/L.