Inventor · disambiguated record
E. Henry Stevens
Also filed as: STEVENS E H · STEVENS E HENRY
19 granted patents·2 pending applications·880 citations·filing 1987–2005
96Inventor score
Top patents by PatentIndex Score
21 records- 0193US4784973ASemiconductor contact silicide/nitride process with control for silicide thicknessINMOS CORP·Filed 1987·Granted Nov 15, 1988·116 cites·11 claims
- 0292US5610099AProcess for fabricating transistors using composite nitride structureRAMTRON INT CORP·Filed 1994·Granted Mar 11, 1997·101 cites·11 claims
- 0390US6508920B1Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Jan 21, 2003·88 cites·53 claims
- 0489US5741721AMethod of forming capacitors and interconnect linesQUALITY MICROCIRCUITS CORP·Filed 1996·Granted Apr 21, 1998·99 cites·23 claims
- 0586US6376374B1Process and manufacturing tool architecture for use in the manufacturing of one or more protected metallization structures on a workpieceSEMITOOL INC·Filed 1998·Granted Apr 23, 2002·64 cites·51 claims
- 0683US5508881ACapacitors and interconnect lines for use with integrated circuitsQUALITY MICROCIRCUITS CORP·Filed 1994·Granted Apr 16, 1996·69 cites·49 claims
- 0782US6120641AProcess architecture and manufacturing tool sets employing hard mask patterning for use in the manufacture of one or more metallization levels on a workpieceSEMITOOL INC·Filed 1998·Granted Sep 19, 2000·67 cites·47 claims
- 0881US6664197B2Process for etching thin-film layers of a workpiece used to form microelectronic circuits or componentsSEMITOOL INC·Filed 2001·Granted Dec 16, 2003·24 cites·20 claims
- 0977US6451114B1Apparatus for application of chemical process to a workpieceQUALITY MICROCIRCUITS CORP·Filed 2000·Granted Sep 17, 2002·19 cites·18 claims
- 1074US5070036AProcess for contacting and interconnecting semiconductor devices within an integrated circuitQUALITY MICROCIRCUITS CORP·Filed 1990·Granted Dec 3, 1991·56 cites·17 claims
- 1173US6143126AProcess and manufacturing tool architecture for use in the manufacture of one or more metallization levels on an integrated circuitSEMITOOL INC·Filed 1998·Granted Nov 7, 2000·45 cites·66 claims
- 1267US5170242AReaction barrier for a multilayer structure in an integrated circuitRAMTRON CORP·Filed 1991·Granted Dec 8, 1992·42 cites·28 claims
- 1364US5385634ASealed self aligned contact processRAMTRON INT CORP·Filed 1993·Granted Jan 31, 1995·21 cites·22 claims
- 1463US6331490B1Process for etching thin-film layers of a workpiece used to form microelectric circuits or componentsSEMITOOL INC·Filed 1998·Granted Dec 18, 2001·25 cites·16 claims
- 1560US6887789B2Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpieceSEMITOOL INC·Filed 2002·Granted May 3, 2005·5 cites·13 claims
- 1659US7462269B2Method for low temperature annealing of metallization micro-structures in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Dec 9, 2008·5 cites·33 claims
- 1755US4977440AStructure and process for contacting and interconnecting semiconductor devices within an integrated circuitSTEVENS E HENRY·Filed 1989·Granted Dec 11, 1990·24 cites·18 claims
- 1853US6994776B2Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Feb 7, 2006·5 cites·6 claims
- 1949US2005247566A1Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpieceSTEVENS E H·Filed 2005·Application pending·0 cites
- 2041US2003026892A1Method for application of a chemical process to a workpieceFiled 2002·Application pending·0 cites
- 2139US7001471B2Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Feb 21, 2006·5 cites·102 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →