Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece

Abstract

A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is applied over the surface of the barrier layer. One or more copper elements are then electroplated on selected portions of the seed layer or, if suitable, the barrier layer. If used, the seed layer is then substantially removed. At least a portion of a surface of the barrier layer is rendered unplatable while leaving the copper elements suitable for electroplating. A protective layer is then electroplated onto surfaces of the one or more copper elements.

1 - 51 . (canceled)  
   
   
       52 . A tool set configuration for fabricating interconnect metallization structures on a workpiece, comprising: 
 a film deposition tool set having a first vapor deposition station for depositing a barrier layer on a workpiece;    a pattern processing tool set including a coating station for depositing a resist on the workpiece and an exposure apparatus configured to expose selected portions of the resist to a radiation for forming a patterned mask; and    a wet processing tool set including a plating station for plating metal into recesses formed in the resist to form interconnect metallization structures over portions of the barrier layer and a first processing station for electrically isolating the metallization structures.    
   
   
       53 . The tool set configuration of  claim 52  wherein the film deposition tool set further comprises a second vapor deposition station for depositing a seed layer onto the barrier layer.  
   
   
       54 . The tool set configuration of  claim 52  wherein the wet tool set further comprises a rinse/dry station for removing resist from the workpiece.  
   
   
       55 . The tool set configuration of  claim 52  wherein: 
 the wet tool set further comprises an etching station;    the plating station of the wet tool set comprises an electroplating station; and    the first processing station of the wet tool set comprises an oxidizing station.    
   
   
       56 . The tool set configuration of  claim 52  wherein: 
 the film deposition tool set further comprises a second vapor deposition station for depositing a seed layer onto the barrier layer; and    the wet tool set further comprises an etching station, the first processing station of the wet tool set comprises a rinse/dry station for removing resist from the workpiece, the plating station of the wet tool set comprises an electroplating station, and the wet tool set further comprises an oxidizing station.