Inventor · disambiguated record
Ying-Ren Lin
Also filed as: LIN YING-REN
7 granted patents·2 pending applications·326 citations·filing 2003–2007
87Inventor score
Top patents by PatentIndex Score
9 records- 0195US7173828B2Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 6, 2007·106 cites·12 claims
- 0294US7271483B2Bump structure of semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 18, 2007·76 cites·18 claims
- 0394US6865084B2Thermally enhanced semiconductor package with EMI shieldingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 8, 2005·120 cites·21 claims
- 0473US7129119B2Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Oct 31, 2006·5 cites·24 claims
- 0570US7348211B2Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 25, 2008·4 cites·26 claims
- 0666US7180183B2Semiconductor device with reinforced under-support structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 20, 2007·15 cites·19 claims
- 0748US2007141761A1Method for fabricating semiconductor packages, and structure and method for positioning semiconductor componentsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 0847US2007054484A1Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 0943US7750450B2Stacked die package with stud spacersINTEL CORP·Filed 2006·Granted Jul 6, 2010·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →