Inventor · disambiguated record
Gi-Young Jeun
Also filed as: JEUN GI-YOUNG
8 granted patents·2 pending applications·271 citations·filing 1999–2020
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0196US7061080B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Jun 13, 2006·127 cites·15 claims
- 0292US7208819B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 24, 2007·69 cites·11 claims
- 0388US10720376B2Discrete power transistor package having solderless DBC to leadframe attachLITTELFUSE INC·Filed 2018·Granted Jul 21, 2020·4 cites·7 claims
- 0483US7501700B2Semiconductor power module having an electrically insulating heat sink and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2006·Granted Mar 10, 2009·12 cites·9 claims
- 0579US6710439B2Three-dimensional power semiconductor module and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Mar 23, 2004·28 cites·21 claims
- 0670US7449774B1Semiconductor power module having an electrically insulating heat sink and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2000·Granted Nov 11, 2008·17 cites·9 claims
- 0769US11387162B2Discrete power transistor package having solderless DBC to leadframe attachIXYS LLC·Filed 2020·Granted Jul 12, 2022·0 cites·7 claims
- 0854US2017178998A1Discrete Power Transistor Package Having Solderless DBC To Leadframe AttachIXYS CORP·Filed 2017·Application pending·0 cites
- 0950US2013175704A1Discrete power transistor package having solderless dbc to leadframe attachJEUN GI-YOUNG·Filed 2012·Application pending·0 cites
- 1046US6365965B1Power semiconductor module with terminals having holes for better adhesionSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 2, 2002·14 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →