Inventor · disambiguated record
Kenji Oonishi
Also filed as: OONISHI KENJI
6 granted patents·6 pending applications·28 citations·filing 1993–2016
78Inventor score
Top patents by PatentIndex Score
12 records- 0171US8779586B2Die bond film, dicing die bond film, and semiconductor deviceOONISHI KENJI·Filed 2011·Granted Jul 15, 2014·4 cites·15 claims
- 0266US10220829B2Hybrid vehicle and control method thereforOONISHI KENJI·Filed 2016·Granted Mar 5, 2019·2 cites·4 claims
- 0363US6838927B2Semiconductor integrated circuit with stabilizing capacityRENESAS TECH CORP·Filed 2002·Granted Jan 4, 2005·16 cites·4 claims
- 0451US8010270B2Vehicle controller and control methodTOYOTA MOTOR CO LTD·Filed 2008·Granted Aug 30, 2011·3 cites·4 claims
- 0546US9630615B2Hybrid vehicle and control method thereforOONISHI KENJI·Filed 2014·Granted Apr 25, 2017·0 cites·9 claims
- 0639US2012153508A1Thermosetting die-bonding filmHAYASHI MIKI·Filed 2009·Application pending·0 cites
- 0736US2010314782A1Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0835US2011190421A1Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor deviceKIMURA YUTA·Filed 2011·Application pending·0 cites
- 0933US2014288740A1Control apparatus for hybrid vehicleITOYAMA DAISUKE·Filed 2014·Application pending·0 cites
- 1033US2011120614A1Thermosetting adhesive film, adhesive film with dicing film, and method of manufacturing semiconductor device using the thermosetting adhesive film or the adhesive film with dicing filmSUGO YUKI·Filed 2010·Application pending·0 cites
- 1128US5423052ACentral processing unit with switchable carry and borrow flagMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 6, 1995·3 cites·10 claims
- 1226US2011057331A1Thermosetting die bonding film, dicing die bonding film and semiconductor deviceHAYASHI MIKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →