Assignee
OONISHI KENJI
JP·3 granted patents·6 citations·filing 2011–2016
Top patents by PatentIndex Score
3 records- 0171US8779586B2Die bond film, dicing die bond film, and semiconductor deviceOONISHI KENJI·Filed 2011·Granted Jul 15, 2014·4 cites·15 claims
- 0266US10220829B2Hybrid vehicle and control method thereforOONISHI KENJI·Filed 2016·Granted Mar 5, 2019·2 cites·4 claims
- 0346US9630615B2Hybrid vehicle and control method thereforOONISHI KENJI·Filed 2014·Granted Apr 25, 2017·0 cites·9 claims
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