Inventor · disambiguated record
Joungln Yang
Also filed as: YANG JOUNGLN
3 granted patents·13 citations·filing 2009–2012
65Inventor score
Top patents by PatentIndex Score
3 records- 0179US8723310B2Integrated circuit packaging system having warpage prevention structuresPARK YISU·Filed 2012·Granted May 13, 2014·8 cites·10 claims
- 0270US8334601B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2011·Granted Dec 18, 2012·2 cites·13 claims
- 0364US7863100B2Integrated circuit packaging system with layered packaging and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·3 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Joungln Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →