Assignee
PARK DONGSAM
KR·7 granted patents·104 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0197US8883561B2Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Nov 11, 2014·71 cites·33 claims
- 0291US8704365B2Integrated circuit packaging system having a cavityPARK DONGSAM·Filed 2011·Granted Apr 22, 2014·13 cites·10 claims
- 0388US9087701B2Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Jul 21, 2015·10 cites·18 claims
- 0482US8598034B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2012·Granted Dec 3, 2013·4 cites·9 claims
- 0570US8334601B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2011·Granted Dec 18, 2012·2 cites·13 claims
- 0667US8110905B2Integrated circuit packaging system with leadframe interposer and method of manufacture thereofPARK DONGSAM·Filed 2008·Granted Feb 7, 2012·4 cites·20 claims
- 0741US8460968B2Integrated circuit packaging system with post and method of manufacture thereofPARK DONGSAM·Filed 2010·Granted Jun 11, 2013·0 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →