Inventor · disambiguated record
David J. West
Also filed as: WEST DAVID J · WEST DAVID JUSTIN
15 granted patents·2 pending applications·87 citations·filing 2009–2019
90Inventor score
Top patents by PatentIndex Score
17 records- 0189US8452475B1Systems and methods for dynamic aircraft maintenance schedulingWEST DAVID J·Filed 2009·Granted May 28, 2013·60 cites·27 claims
- 0286US10340241B2Chip-on-chip structure and methods of manufactureIBM·Filed 2015·Granted Jul 2, 2019·4 cites·17 claims
- 0384US9368425B2Embedded heat spreader with electrical propertiesGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 14, 2016·7 cites·20 claims
- 0476US8415792B2Electrical contact alignment postsWEST DAVID JUSTIN·Filed 2010·Granted Apr 9, 2013·5 cites·9 claims
- 0574US10734346B2Method of manufacturing chip-on-chip structure comprising sinterted pillarsIBM·Filed 2019·Granted Aug 4, 2020·1 cites·15 claims
- 0674US9721852B2Semiconductor TSV device package to which other semiconductor device package can be later attachedIBM·Filed 2014·Granted Aug 1, 2017·3 cites·6 claims
- 0767US9478453B2Sacrificial carrier dicing of semiconductor wafersIBM·Filed 2014·Granted Oct 25, 2016·1 cites·16 claims
- 0864US9508690B2Semiconductor TSV device package for circuit board connectionIBM·Filed 2015·Granted Nov 29, 2016·1 cites·17 claims
- 0964US8304290B2Overcoming laminate warpage and misalignment in flip-chip packagesGRAF RICHARD S·Filed 2009·Granted Nov 6, 2012·3 cites·25 claims
- 1063US9570422B2Semiconductor TSV device package for circuit board connectionIBM·Filed 2014·Granted Feb 14, 2017·1 cites·17 claims
- 1163US8530345B2Electrical contact alignment postsIBM·Filed 2013·Granted Sep 10, 2013·1 cites·6 claims
- 1259US2019244926A1Chip-on-chip structure and methods of manufactureIBM·Filed 2019·Application pending·0 cites
- 1352US2016365329A1Chip-on-chip structure and methods of manufactureIBM·Filed 2016·Application pending·0 cites
- 1450US9484239B2Sacrificial carrier dicing of semiconductor wafersIBM·Filed 2015·Granted Nov 1, 2016·0 cites·9 claims
- 1547US9818653B2Semiconductor TSV device package to which other semiconductor device package can be later attachedIBM·Filed 2015·Granted Nov 14, 2017·0 cites·12 claims
- 1645US9433105B2Method of fabricating printed circuit boardsGRAF RICHARD STEPHEN·Filed 2009·Granted Aug 30, 2016·0 cites·13 claims
- 1735US9754911B2IC structure with angled interconnect elementsGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 5, 2017·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →