US2016365329A1PendingUtilityA1

Chip-on-chip structure and methods of manufacture

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Assignee: IBMPriority: Jun 11, 2015Filed: Mar 29, 2016Published: Dec 15, 2016
Est. expiryJun 11, 2035(~8.9 yrs left)· nominal 20-yr term from priority
Inventors:Richard S. GrafJay F. LeonardDavid J. WestCharles H. Wilson
H10W 90/724H10W 90/722H10W 90/28H10W 90/20H10W 74/15H10W 74/012H10W 72/07254H10W 72/07253H10W 72/07252H10W 72/07236H10W 72/07232H10W 72/01271H10W 72/01261H10W 72/01236H10W 72/01225H10W 72/252H10W 72/248H10W 72/247H10W 72/244H10W 72/241H10W 72/237H10W 72/234H10W 72/227H10W 72/222H10W 72/221H10W 72/0198H10W 72/072H10W 72/012H10W 42/121H10W 72/073H10W 90/734H10W 90/732H10W 90/00H01L 2224/17104H01L 2224/16059H01L 2224/16227H01L 24/17H01L 24/16H01L 23/3178H01L 23/04
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Claims

Abstract

Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A structure, comprising:
 a plurality of sintered pillars with a solder cap,   a chip joined to the wafer, between a plurality of sintered copper pillars;   a laminate board joined to the wafer by the solder cap of the plurality of sintered copper pillars or other conductive material; and   an underfill material bonding the chip, the wafer and the laminate board.   
     
     
         2 . The structure of  claim 1 , wherein the plurality of sintered pillars are one of tapered and hourglass shaped. 
     
     
         3 . The structure of  claim 1 , wherein the plurality of sintered pillars have a height of approximately 75 μm or greater on a wafer. 
     
     
         4 . The structure of  claim 1 , wherein the plurality of sintered pillars are copper sintered pillars. 
     
     
         5 . The structure of  claim 1 , wherein the plurality of sintered pillars have a height of approximately 500 μm. 
     
     
         6 . The structure of  claim 1 , wherein the plurality of sintered pillars are tapered. 
     
     
         7 . The structure of  claim 1 , wherein the plurality of sintered pillars are shaped as an hourglass. 
     
     
         8 . The structure of  claim 1 , wherein the plurality of sintered pillars are shaped are shaped as cones with its bases being wider in diameter than its end at the solder cap.

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