Inventor · disambiguated record
Anang Subagio
Also filed as: SUBAGIO ANANG
14 granted patents·3 pending applications·526 citations·filing 2004–2011
94Inventor score
Technology areasH10W
Files withUNISEM MAURITIUS HOLDINGS LTD9SAN ANTONIO ROMARICO S3ADVANCED INTERCONNECT TECH LTD1RAMOS MARY JEAN1RAMOS MARY JEAN BAJACAN1
Top patents by PatentIndex Score
17 records- 0197US7262491B2Die pad for semiconductor packages and methods of making and using sameADVANCED INTERCONNECT TECH LTD·Filed 2005·Granted Aug 28, 2007·89 cites·18 claims
- 0295US7790500B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Sep 7, 2010·86 cites·19 claims
- 0393US7799611B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingUNISEM MAURITIUS HOLDINGS LTD·Filed 2006·Granted Sep 21, 2010·40 cites·33 claims
- 0493US7741158B2Method of making thermally enhanced substrate-base packageUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Jun 22, 2010·109 cites·8 claims
- 0592US8084300B1RF shielding for a singulated laminate semiconductor device packageSAN ANTONIO ROMARICO S·Filed 2010·Granted Dec 27, 2011·56 cites·25 claims
- 0692US7943431B2Leadless semiconductor package and method of manufactureUNISEM MAURITIUS HOLDINGS LTD·Filed 2006·Granted May 17, 2011·28 cites·14 claims
- 0791US8236612B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingSAN ANTONIO ROMARICO S·Filed 2011·Granted Aug 7, 2012·24 cites·16 claims
- 0886US7820480B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Oct 26, 2010·12 cites·8 claims
- 0983US7816186B2Method for making QFN package with power and ground ringsUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Oct 19, 2010·12 cites·20 claims
- 1083US7700414B1Method of making flip-chip package with underfillUNISEM MAURITIUS HOLDINGS LTD·Filed 2007·Granted Apr 20, 2010·22 cites·12 claims
- 1175US7795710B2Lead frame routed chip pads for semiconductor packagesUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Sep 14, 2010·19 cites·14 claims
- 1272US7563648B2Semiconductor device package and method for manufacturing sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Jul 21, 2009·23 cites·33 claims
- 1364US8022512B2No lead package with heat spreaderUNISEM MAURITUS HOLDINGS LTD·Filed 2007·Granted Sep 20, 2011·4 cites·5 claims
- 1459US8304864B2Lead frame routed chip pads for semiconductor packagesSAN ANTONIO ROMARICO SANTOS·Filed 2010·Granted Nov 6, 2012·2 cites·58 claims
- 1544US2011304032A1No lead package with heat spreaderRAMOS MARY JEAN BAJACAN·Filed 2011·Application pending·0 cites
- 1640US2011057298A1Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor PackagingRAMOS MARY JEAN·Filed 2010·Application pending·0 cites
- 1734US2012126378A1Semiconductor device package with electromagnetic shieldingSAN ANTONIO ROMARICO S·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →