Assignee
ADVANCED INTERCONNECT TECH LTD
HK·14 granted patents·1,113 citations·filing 1990–2005
Top patents by PatentIndex Score
14 records- 0198US6812552B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Nov 2, 2004·264 cites·12 claims
- 0297US7262491B2Die pad for semiconductor packages and methods of making and using sameADVANCED INTERCONNECT TECH LTD·Filed 2005·Granted Aug 28, 2007·89 cites·18 claims
- 0394US6501185B1Barrier cap for under bump metalADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Dec 31, 2002·129 cites·18 claims
- 0494US6413851B1Method of fabrication of barrier cap for under bump metalADVANCED INTERCONNECT TECH LTD·Filed 2001·Granted Jul 2, 2002·124 cites·21 claims
- 0592US7259445B2Thermal enhanced package for block mold assemblyADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 21, 2007·101 cites·13 claims
- 0692US7129116B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Oct 31, 2006·41 cites·11 claims
- 0789US6638847B1Method of forming lead-free bump interconnectionsADVANCED INTERCONNECT TECH LTD·Filed 2000·Granted Oct 28, 2003·119 cites·11 claims
- 0886US6262477B1Ball grid array electronic packageADVANCED INTERCONNECT TECH LTD·Filed 1993·Granted Jul 17, 2001·88 cites·28 claims
- 0985US6777265B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 17, 2004·43 cites·13 claims
- 1081US6300673B1Edge connectable metal packageADVANCED INTERCONNECT TECH LTD·Filed 1995·Granted Oct 9, 2001·56 cites·17 claims
- 1172US7247933B2Thin multiple semiconductor die packageADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Jul 24, 2007·16 cites·18 claims
- 1265US7489021B2Lead frame with included passive devicesADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Feb 10, 2009·17 cites·35 claims
- 1354US5952719AMetal ball grid electronic package having improved solder jointADVANCED INTERCONNECT TECH LTD·Filed 1997·Granted Sep 14, 1999·20 cites·20 claims
- 1423US5071381AProcess for the manufacture of straw tube drift chambersADVANCED INTERCONNECT TECH LTD·Filed 1990·Granted Dec 10, 1991·6 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →