Inventor · disambiguated record
Chun-Hsien Chien
Also filed as: CHIEN CHUN WEN · CHIEN CHUN-HSIEN
28 granted patents·13 pending applications·57 citations·filing 2002–2025
94Inventor score
Top patents by PatentIndex Score
41 records- 0195US10888001B2Circuit carrier board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 5, 2021·14 cites·12 claims
- 0294US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0394US11579178B1Inspection apparatus for bare circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 14, 2023·8 cites·10 claims
- 0491US10461146B1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Oct 29, 2019·10 cites·10 claims
- 0590US9854671B1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 26, 2017·4 cites·10 claims
- 0689US11139234B1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 5, 2021·2 cites·5 claims
- 0786US10123418B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Nov 6, 2018·5 cites·20 claims
- 0884US10660202B1Carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·4 cites·14 claims
- 0984US9860980B1Circuit board elementUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·4 cites·10 claims
- 1078US2025227857A1Manufacturing method of circuit carrierUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1174US11251350B2Light-emitting diode package and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Feb 15, 2022·2 cites·7 claims
- 1270US10700049B2Light-emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·1 cites·9 claims
- 1369US10797017B2Embedded chip package, manufacturing method thereof, and package-on-package structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 6, 2020·1 cites·20 claims
- 1466US2021282277A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 1564US11532543B2Manufacturing method of package carrierUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Dec 20, 2022·0 cites·5 claims
- 1662US10886264B2Manufacturing method of light-emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 5, 2021·0 cites·10 claims
- 1761US12219711B2Bare circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 1861US11348869B2Method of manufacturing chip packaging structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 31, 2022·0 cites·7 claims
- 1961US2025096145A1Electronic packaging structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2060US11678441B2Manufacturing method of circuit carrier board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jun 13, 2023·0 cites·7 claims
- 2160US11032917B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 8, 2021·0 cites·11 claims
- 2260US10950687B2Manufacturing method of substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 16, 2021·0 cites·11 claims
- 2360US2021193608A1Circuit board element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2459US2021219435A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2556US12292468B2Inspection system and inspection method of bare circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted May 6, 2025·0 cites·16 claims
- 2655US10700161B2Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·0 cites·9 claims
- 2754US10999939B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 4, 2021·0 cites·5 claims
- 2854US10879167B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Dec 29, 2020·0 cites·9 claims
- 2953US2020013744A1Circuit board element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 3052US9969152B2Method for producing glass substrateNIPPON ELECTRIC GLASS CO·Filed 2016·Granted May 15, 2018·0 cites·3 claims
- 3151US2022287182A1Embedded component structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3246US2022022316A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 3345US11201123B2Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Dec 14, 2021·0 cites·5 claims
- 3445US11037869B2Package structure and preparation method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 15, 2021·0 cites·5 claims
- 3545US10863618B2Composite substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Dec 8, 2020·0 cites·15 claims
- 3645US2019380200A1Embedded component structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 3742US10937723B2Package carrier structure having integrated circuit design and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Mar 2, 2021·0 cites·18 claims
- 3842US2013234325A1Filled through-silicon via and the fabrication method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 3940US2006138085A1Plasma etching method with reduced particles productionCHIEN CHUN-HSIEN·Filed 2004·Application pending·0 cites
- 4033US2002196722A1Method and device for increasing CD-R yieldFiled 2002·Application pending·0 cites
- 4132US2012133046A1Semiconductor structure and process thereofCHIEN CHUN-HSIEN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chun-Hsien Chien files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →