Manufacturing method of circuit carrier board

Abstract

A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.

What is claimed is: 
     
         1 . A manufacturing method of a circuit carrier board, comprising:
 providing a temporary carrier board;   forming a first build-up layer structure on the temporary carrier board, the first build-up layer structure comprising:
 a plurality of first dielectric layers; and 
 a plurality of first circuit layers disposed in the first dielectric layers; 
   forming a substrate, the substrate comprising a second build-up layer structure, wherein the second build-up layer structure comprises:
 a plurality of second dielectric layers; and 
 a plurality of second circuit layers disposed in the second dielectric layers, wherein a topmost layer of the second circuit layers is exposed outside of the second dielectric layers; 
   disposing an adhesive layer on one of the first build-up layer structure or the second build-up layer structure;   bonding the first build-up layer structure to the second build-up layer structure, wherein the adhesive layer is between the first build-up layer structure and the second build-up layer structure;   removing the temporary carrier;   performing a drilling process on the first build-up layer structure while penetrating the plurality of the first dielectric layers, the plurality of the first circuit layers, and the adhesive layer to form a blind via to expose a portion of the topmost layer of the second circuit layers; and   forming a conductive structure in the blind via, and the conductive structure electrically connects the first circuit layers to the topmost layer of the second circuit layers.   
     
     
         2 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the first substrate comprises:
 stacking the first circuit layers and the first dielectric layers alternatively on the temporary carrier board,   wherein the first circuit layers are electrically connected to each other.   
     
     
         3 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the substrate comprises:
 providing a base; and   forming the second build-up layer structure on the base,   wherein the second circuit layers and the second dielectric layers in the second build-up layer structure are alternately stacked on the base, and the second circuit layers are electrically connected to each other.   
     
     
         4 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the conductive structure comprises:
 forming a photoresist pattern on the first build-up layer structure;   using the photoresist pattern as a mask, and disposing a conductive material in the blind via to form the conductive structure having a continuous sidewall, wherein the conductive structure serially connects the first circuit layers in a direction perpendicular to the substrate; and   removing the photoresist pattern.   
     
     
         5 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the conductive structure comprises:
 forming a conductive material on the first build-up layer structure, and the conductive material is filled into the blind via; and   performing a planarization process to remove a portion of the conductive material so as to form the conductive structure having a continuous sidewall from the conductive material filled in the blind via, wherein the conductive structure serially connects the first circuit layers in a direction perpendicular to the substrate.   
     
     
         6 . The manufacturing method of the circuit carrier board according to  claim 1 , further comprising:
 forming a solder resist layer partially covering the first build-up layer structure and the conductive structure, wherein the solder resist layer has a plurality of openings respectively partially exposing one of the first circuit layers and the conductive structures.