Manufacturing method of circuit carrier board

Abstract

A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

What is claimed is: 
     
         1 . A manufacturing method of a circuit carrier board, comprising:
 providing a first temporary carrier board;   forming a first substrate on the first temporary carrier board, wherein the first substrate comprises a first circuit layer and a plurality of conductive structures, and the conductive structures being adapted to be electrically connected to a plurality of electronic elements;   performing a bonding step of bonding the first substrate to a second temporary carrier board, and the conductive structures are located between the first circuit layer and the second temporary carrier board;   removing the first temporary carrier board;   forming a second substrate on the first substrate to bond the second substrate to the first substrate, wherein the second substrate comprising:
 a plurality of dielectric layers; and 
 a plurality of second circuit layers disposed in the dielectric layers, wherein a bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and a topmost layer of the second circuit layers is electrically connected to the first circuit layer; and 
   removing the second temporary carrier board.   
     
     
         2 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the first substrate comprises:
 forming a release layer on the first temporary carrier board;   forming the first circuit layer on the release layer;   forming an insulating layer on the release layer and covering the first circuit layer;   forming the conductive structures on the insulating layer, and the conductive structures are electrically connected to the first circuit layer; and   Forming an insulating adhesive material on the insulating layer, and the conductive structures are located between the insulating adhesive material and the insulating layer.   
     
     
         3 . The manufacturing method of the circuit carrier board according to  claim 2 , wherein the step of forming the first substrate further comprises:
 performing a thinning process to remove a portion of the insulating adhesive material to form an insulating adhesive layer and exposing the conductive structures.   
     
     
         4 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the second substrate comprises:
 forming the dielectric layers stacked on the first substrate in sequence; and   forming the second circuit layers in the dielectric layers, and the second circuit layers are electrically connected to one another.   
     
     
         5 . The manufacturing method of the circuit carrier board according to  claim 4 , wherein the second substrate is disposed on the insulating layer. 
     
     
         6 . The manufacturing method of the circuit carrier board according to  claim 1 , wherein the step of forming the first substrate comprises:
 forming a release layer on the first temporary carrier board;   forming the first circuit layer on the release layer; and   forming an insulating adhesive material on the first circuit layer.   
     
     
         7 . The manufacturing method of the circuit carrier board according to  claim 6 , wherein the second substrate is disposed on the insulating adhesive material. 
     
     
         8 . The manufacturing method of the circuit carrier board according to  claim 6 , wherein the step of forming the first substrate further comprises:
 after the step of forming the second substrate on the first substrate, forming a plurality of contact windows in the insulating adhesive material to form an insulating adhesive layer; and   forming the conductive structures in the insulating adhesive layer, and the conductive structures are electrically connected to the first circuit layer through the contact windows.   
     
     
         9 . The manufacturing method of the circuit carrier board according to  claim 1 , further comprising:
 forming a plurality of solder resist layers on the first substrate and the second substrate respectively, wherein the solder resist layers partially covering the conductive structures and the bottommost layer of the second circuit layers; and   disposing a plurality of solder balls and electrically connecting the solder balls to the bottommost layer of the second circuit layers.