Inventor · disambiguated record
Wei-Ti Lin
Also filed as: LIN WEI-TI
16 granted patents·4 pending applications·30 citations·filing 2016–2023
89Inventor score
Files withUNIMICRON TECHNOLOGY CORP20
Top patents by PatentIndex Score
20 records- 0195US10888001B2Circuit carrier board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jan 5, 2021·14 cites·12 claims
- 0290US9854671B1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 26, 2017·4 cites·10 claims
- 0389US11139234B1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 5, 2021·2 cites·5 claims
- 0486US10123418B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Nov 6, 2018·5 cites·20 claims
- 0584US9860980B1Circuit board elementUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·4 cites·10 claims
- 0670US10700049B2Light-emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·1 cites·9 claims
- 0766US2021282277A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0864US11532543B2Manufacturing method of package carrierUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Dec 20, 2022·0 cites·5 claims
- 0962US10886264B2Manufacturing method of light-emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 5, 2021·0 cites·10 claims
- 1061US11348869B2Method of manufacturing chip packaging structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 31, 2022·0 cites·7 claims
- 1160US11678441B2Manufacturing method of circuit carrier board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jun 13, 2023·0 cites·7 claims
- 1260US11032917B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 8, 2021·0 cites·11 claims
- 1360US10950687B2Manufacturing method of substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 16, 2021·0 cites·11 claims
- 1459US2021219435A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 1555US10700161B2Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 30, 2020·0 cites·9 claims
- 1654US10999939B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 4, 2021·0 cites·5 claims
- 1754US10879167B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Dec 29, 2020·0 cites·9 claims
- 1854US2025149392A1Package substrate and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1946US2022022316A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 2045US11037869B2Package structure and preparation method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 15, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →