Inventor · disambiguated record
Jun Oh Hwang
Also filed as: HWANG JUN OH
12 granted patents·12 pending applications·25 citations·filing 2008–2022
87Inventor score
Files withSAMSUNG ELECTRO MECH18HWANG JUN-OH2LEE EUNG SUEK2SAMSUNG ELECTRONICS CO LTD1UNIV SUNGKYUNKWAN1
Top patents by PatentIndex Score
24 records- 0192US10026678B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·8 cites·18 claims
- 0286US11259404B2Rigid-flexible printed circuit board and electronic component moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 22, 2022·2 cites·29 claims
- 0378US11172574B2Printed circuit board assemblySAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 9, 2021·2 cites·19 claims
- 0478US10396037B2Fan-out semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 27, 2019·4 cites·21 claims
- 0577US11134576B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 28, 2021·2 cites·20 claims
- 0671US10833041B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 10, 2020·2 cites·15 claims
- 0770US10283439B2Fan-out semiconductor package including electromagnetic interference shielding layerSAMSUNG ELECTRO MECH·Filed 2018·Granted May 7, 2019·1 cites·10 claims
- 0869US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 0962US11715821B2Electronic element module and printed circuit board for the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 1, 2023·0 cites·23 claims
- 1060US8633396B2Die mounting substrate and method of fabricating the sameLEE EUNG SUEK·Filed 2010·Granted Jan 21, 2014·2 cites·1 claims
- 1158US12089337B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 10, 2024·0 cites·17 claims
- 1254US2010230146A1Circuit layer comprising cnts and method of manufacturing the sameLEE EUNG SUEK·Filed 2009·Application pending·0 cites
- 1350US2009294956A1Cooling fin and package substrate comprising the cooling fin and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1449US8166647B2Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2009·Granted May 1, 2012·0 cites·6 claims
- 1549US2014106510A1Die mounting substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1649US2009308650A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1749US2009294739A1Conductive paste including a carbon nanotube and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1848US2009017275A1Heat-releasing printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1947US2009114425A1Conductive paste and printed circuit board using the sameUNIV SUNGKYUNKWAN·Filed 2008·Application pending·0 cites
- 2046US2012168205A1Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2012·Application pending·0 cites
- 2144US2015179594A1Package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2241US2011073252A1Conductive paste and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2335US2016105956A1Printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2433US2016007467A1Package structure and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →