Inventor · disambiguated record
Andreas Norbert Wiswesser
Also filed as: WISWESSER ANDREAS N · WISWESSER ANDREAS NORBERT
26 granted patents·3 pending applications·1,568 citations·filing 1998–2007
98Inventor score
Files withAPPLIED MATERIALS INC28
Top patents by PatentIndex Score
29 records- 0198US7018271B2Method for monitoring a substrate during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·127 cites·14 claims
- 0298US6190234B1Endpoint detection with light beams of different wavelengthsAPPLIED MATERIALS INC·Filed 1999·Granted Feb 20, 2001·309 cites·22 claims
- 0398US6159073AMethod and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted Dec 12, 2000·233 cites·28 claims
- 0496US6296548B1Method and apparatus for optical monitoring in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 2, 2001·132 cites·15 claims
- 0595US6280289B1Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layersAPPLIED MATERIALS INC·Filed 1998·Granted Aug 28, 2001·187 cites·22 claims
- 0694US6524165B1Method and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·39 cites·17 claims
- 0794US6247998B1Method and apparatus for determining substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1999·Granted Jun 19, 2001·124 cites·50 claims
- 0893US7008295B2Substrate monitoring during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Mar 7, 2006·43 cites·53 claims
- 0991US6994607B2Polishing pad with windowAPPLIED MATERIALS INC·Filed 2003·Granted Feb 7, 2006·31 cites·22 claims
- 1091US6716085B2Polishing pad with transparent windowAPPLIED MATERIALS INC·Filed 2001·Granted Apr 6, 2004·39 cites·23 claims
- 1191US6652355B2Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layersAPPLIED MATERIALS INC·Filed 2001·Granted Nov 25, 2003·44 cites·20 claims
- 1289US7547243B2Method of making and apparatus having polishing pad with windowAPPLIED MATERIALS INC·Filed 2007·Granted Jun 16, 2009·15 cites·12 claims
- 1387US7198544B2Polishing pad with windowAPPLIED MATERIALS INC·Filed 2005·Granted Apr 3, 2007·10 cites·7 claims
- 1487US6607422B1Endpoint detection with light beams of different wavelengthsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 19, 2003·30 cites·23 claims
- 1587US6506097B1Optical monitoring in a two-step chemical mechanical polishing processAPPLIED MATERIALS INC·Filed 2001·Granted Jan 14, 2003·36 cites·20 claims
- 1685US7264536B2Polishing pad with windowAPPLIED MATERIALS INC·Filed 2003·Granted Sep 4, 2007·25 cites·23 claims
- 1785US6832950B2Polishing pad with windowAPPLIED MATERIALS INC·Filed 2002·Granted Dec 21, 2004·26 cites·33 claims
- 1883US6811466B1System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·21 cites·10 claims
- 1981US7086929B2Endpoint detection with multiple light beamsAPPLIED MATERIALS INC·Filed 2003·Granted Aug 8, 2006·21 cites·17 claims
- 2078US6494766B1Method and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·17 cites·26 claims
- 2176US6632124B2Optical monitoring in a two-step chemical mechanical polishing processAPPLIED MATERIALS INC·Filed 2003·Granted Oct 14, 2003·17 cites·14 claims
- 2272US6764380B2Method and apparatus for measuring substrate layer thickness during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jul 20, 2004·11 cites·8 claims
- 2369US6913511B2Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layersAPPLIED MATERIALS INC·Filed 2003·Granted Jul 5, 2005·9 cites·20 claims
- 2465US6659842B2Method and apparatus for optical monitoring in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·10 cites·27 claims
- 2561US7101254B2System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2004·Granted Sep 5, 2006·5 cites·3 claims
- 2661US6986699B2Method and apparatus for determining polishing endpoint with multiple light sourcesAPPLIED MATERIALS INC·Filed 2001·Granted Jan 17, 2006·7 cites·36 claims
- 2752US2006246822A1System and method for in-line metal profile measurementAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2847US2005173259A1Endpoint system for electro-chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2938US2004082271A1Polishing pad with windowFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →