Inventor · disambiguated record
Jaeun Yun
Also filed as: YUN JAEUN
7 granted patents·2 pending applications·72 citations·filing 2008–2013
83Inventor score
Top patents by PatentIndex Score
9 records- 0196US8263435B2Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive viasCHOI DAESIK·Filed 2010·Granted Sep 11, 2012·47 cites·25 claims
- 0283US9252032B2Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive viasCHOI DAESIK·Filed 2012·Granted Feb 2, 2016·6 cites·31 claims
- 0376US8569882B2Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereofKO WONJUN·Filed 2011·Granted Oct 29, 2013·5 cites·17 claims
- 0473US8524537B2Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residueYUN JAEUN·Filed 2010·Granted Sep 3, 2013·4 cites·28 claims
- 0571US9136144B2Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulationLIM TAEGKI·Filed 2009·Granted Sep 15, 2015·10 cites·25 claims
- 0647US7969023B2Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jun 28, 2011·0 cites·20 claims
- 0746US2013256840A1Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape ResidueSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 0845US8415204B2Integrated circuit packaging system with heat spreader and method of manufacture thereofYUN JAEUN·Filed 2009·Granted Apr 9, 2013·0 cites·20 claims
- 0939US2012224332A1Integrated circuit packaging system with bump bonded dies and method of manufacture thereofYUN JAEUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →