Inventor · disambiguated record
Satoru Amou
Also filed as: AMOU SATORU
27 granted patents·16 pending applications·164 citations·filing 1989–2015
96Inventor score
Top patents by PatentIndex Score
43 records- 0195US8470723B2Low softening point glass composition, bonding material using same and electronic partsNAITO TAKASHI·Filed 2010·Granted Jun 25, 2013·19 cites·19 claims
- 0286US8685872B2Low softening point glass composition, bonding material using same and electronic partsHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 1, 2014·3 cites·6 claims
- 0385US9034475B2Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the sameHITACHI CABLE·Filed 2013·Granted May 19, 2015·3 cites·19 claims
- 0484US8115105B2Prepreg and its application products for low thermal expansion and low dielectric tangentAMOU SATORU·Filed 2009·Granted Feb 14, 2012·6 cites·14 claims
- 0583US8227361B2Prepreg and printed wiring board using thin quartz glass clothAMOU SATORU·Filed 2009·Granted Jul 24, 2012·5 cites·19 claims
- 0683US7638564B2Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnishHITACHI CHEMICAL CO LTD·Filed 2006·Granted Dec 29, 2009·4 cites·7 claims
- 0772US6190834B1Photosensitive resin composition, and multilayer printed circuit board using the sameHITACHI LTD·Filed 1998·Granted Feb 20, 2001·44 cites·19 claims
- 0869US6756441B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2001·Granted Jun 29, 2004·9 cites·9 claims
- 0966US7193009B2Electronic device using low dielectric loss tangent insulators for high frequency signalsHITACHI LTD·Filed 2003·Granted Mar 20, 2007·11 cites·19 claims
- 1064US8420210B2Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereofAMOU SATORU·Filed 2007·Granted Apr 16, 2013·2 cites·20 claims
- 1164US8097545B2Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin compositionAMOU SATORU·Filed 2007·Granted Jan 17, 2012·2 cites·11 claims
- 1262US7273900B2Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Sep 25, 2007·8 cites·9 claims
- 1361US8735724B2Electric equipment having insulation structure at welding partsMURAKI TAKAHITO·Filed 2011·Granted May 27, 2014·2 cites·4 claims
- 1461US7294905B2Thin film capacitor and electronic circuit componentHITACHI LTD·Filed 2002·Granted Nov 13, 2007·10 cites·15 claims
- 1561US2008221261A1Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2008·Application pending·0 cites
- 1660US9028970B2Adhesive composition, varnish, adhesive film and wiring filmHITACHI CABLE FINE TECH LTD·Filed 2013·Granted May 12, 2015·2 cites·18 claims
- 1760US5914216AMultilayer circuit board and photosensitive resin composition used thereforHITACHI LTD·Filed 1997·Granted Jun 22, 1999·18 cites·16 claims
- 1859US5565536APolymerizable compouund, process for producing same and setting composition containing polymerizable compoundHITACHI LTD·Filed 1995·Granted Oct 15, 1996·6 cites·7 claims
- 1958US6930140B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2003·Granted Aug 16, 2005·2 cites·6 claims
- 2055US2008261472A1Prepreg, multilayer printed wiring board and electronic parts using the sameHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 2153US8507592B2Adhesive composition, adhesive film and wiring film using the sameAMOU SATORU·Filed 2011·Granted Aug 13, 2013·0 cites·18 claims
- 2252US9493605B2Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured productHITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD·Filed 2013·Granted Nov 15, 2016·0 cites·10 claims
- 2352US7375155B2Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereofHITACHI LTD·Filed 2005·Granted May 20, 2008·0 cites·6 claims
- 2450US2014141254A1Self-repairing laminated structure and self-fusing insulated wireHITACHI LTD·Filed 2012·Application pending·0 cites
- 2549US2013209802A1Thermosetting resin composition, cured material, conductive wire, coil for electrical device, and electrical deviceHITACHI LTD·Filed 2013·Application pending·0 cites
- 2649US2010156587A1Thermosetting resin composition and coil for electric machineHITACHI LTD·Filed 2009·Application pending·0 cites
- 2748US5410069APolymerizable compound, process for producing same and setting composition containing polymerizable compoundHITACHI LTD·Filed 1992·Granted Apr 25, 1995·2 cites·33 claims
- 2848US2016163420A1Insulated Wire and Dynamo-Electric Machine Using the SameHITACHI LTD·Filed 2013·Application pending·0 cites
- 2948US2015152230A1Thermosetting resin composition and electrical device using sameHITACHI LTD·Filed 2013·Application pending·0 cites
- 3047US6855952B2Semiconductor device and semiconductor packageHITACHI LTD·Filed 2003·Granted Feb 15, 2005·2 cites·16 claims
- 3147US2015337106A1Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using SameHITACHI LTD·Filed 2012·Application pending·0 cites
- 3247US2012037410A1Thermoplastic resin composition, adhesive film and wiring film using the sameAMOU SATORU·Filed 2011·Application pending·0 cites
- 3345US2004180157A1Tube laminate and method for producing the sameFiled 2004·Application pending·0 cites
- 3442US9090796B2Organic-inorganic composite materials containing triazine rings and electrical devices using the sameHITACHI LTD·Filed 2012·Granted Jul 28, 2015·0 cites·14 claims
- 3542US2011088933A1Low dielectric loss wiring board, multilayer wiring board, copper foil and laminateAMOU SATORU·Filed 2010·Application pending·0 cites
- 3641US2014211373A1Organic-inorganic composite and method for manufacturing the sameOYAMA TAKU·Filed 2012·Application pending·0 cites
- 3740US7112627B2Low dielectric loss tangent films and wiring filmsHITACHI LTD·Filed 2003·Granted Sep 26, 2006·0 cites·20 claims
- 3840US2005020781A1Resin composition containing rubber component, and film and electronic part using the sameFiled 2004·Application pending·0 cites
- 3939US5071824AHeat transfer sheet, method for producing it, and method of heat transferHITACHI LTD·Filed 1989·Granted Dec 10, 1991·3 cites·4 claims
- 4038US2016042836A1Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated WireHITACHI LTD·Filed 2015·Application pending·0 cites
- 4135US2011316661A1Unsaturated polyester resin composition for coil adhesionMURAKI TAKAHITO·Filed 2011·Application pending·0 cites
- 4230US6306481B1Multilayer circuit board having insulating layer with via-holesHITACHI LTD·Filed 1999·Granted Oct 23, 2001·1 cites·11 claims
- 4328US2017145209A1Resin composition and electrical deviceHITACHI LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →