Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof

Abstract

According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R 1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

1 - 13 . (canceled) 
     
     
         14 . A resin composition comprising a multifunctional monomer having styrene groups linked with a hydrocarbon skeleton as a crosslinking component, the composition giving a cured product having a tensile strength of not lower than 40.7 MPa. 
     
     
         15 . The composition of  claim 14 , wherein the multifunctional monomer has a weight average molecular weight of not more than 1,000. 
     
     
         16 . The composition of  claim 14 , wherein the multifunctional monomer has the formula, 
       
         
           
           
               
               
           
         
       
       wherein R is a hydrocarbon skeleton which may have a substituent; R 1  is hydrogen, methyl or ethyl; m is an integer of 1-4 and n is an integer of 2 or more. 
     
     
         17 . The composition of  claim 14 , wherein the composition gives a cured product having a dielectric loss tangent after curing of not more than 0.002. 
     
     
         18 . The composition of  claim 14 , further containing at least one member selected from a high polymer and a filler. 
     
     
         19 . The composition of  claim 14 , wherein the composition gives a cured product having a glass transition temperature of not lower than 128° C.