Resin composition and electrical device

Abstract

It is an object of the present invention to provide an excellent thermosetting resin that achieves both higher heat resistance and higher toughness and mechanical strength for improving cracking resistance and lower viscosity which are conventionally in a trade-off relationship. It is also an object of the present invention to provide an electronic•electrical device using a cured product of the thermosetting resin as an insulating material or a structural material. The present invention includes a plurality of means for achieving the above objects, and one of the means is a thermosetting resin composition comprising: a three-dimensional copolymer obtained by copolymerizing a maleimide derivative and a styrene derivative with use of an alkyl borane or a boron compound as a polymerization initiator; and a thermosetting resin composition.

1 . A resin composition having a bicontinuous phase structure comprising a three-dimensional copolymer and a thermosetting resin composition, wherein
 the three-dimensional copolymer comprises a monomer component and a polymerization initiator and has a 5% weight loss temperature of 350° C. or higher,   a ratio between the polymerization initiator (X) and the monomer component (Y) is 0.005 to 0.1 (X/Y),   the monomer component comprises a maleimide derivative and a styrene derivative, and   the polymerization initiator comprises an alkyl borane or a boron compound.   
     
     
         2 . The resin composition according to  claim 1 , wherein
 the maleimide derivative comprises N-phenylmaleimide or N-cyclohexylmaleimide.   
     
     
         3 . The resin composition according to  claim 1 , wherein
 the three-dimensional copolymer is represented by Formula 1 or Formula 2,
 R1 is any one of a phenyl group, a substituted phenyl group, a cyclohexyl group, and an alkyl group having 1 to 6 carbon atoms, 
 R2 is —(CH 2 CH 2 O) p R4 wherein p is an integer of 1 to 150, 
 R3 is a hydrogen atom or a methyl group, 
 R4 is any one of a phenyl group, a substituted phenyl group, a cyclohexyl group, and an alkyl group having 1 to 6 carbon atoms, a ratio between n and m (n/m) is 1000/1 to 80/20, n is an integer of 4 or more, and m is an integer of 1 or more. 
   
       
         
           
           
               
               
           
         
       
     
     
         4 . The resin composition according to  claim 1 , wherein
 the thermosetting resin composition comprises at least one of an epoxy resin, a cyanate resin, a bismaleimide resin, and an unsaturated polyester resin.   
     
     
         5 . The resin composition according to  claim 1 , wherein the three-dimensional copolymer is contained in an amount of 1 to 30 parts by mass per 100 parts by mass of the thermosetting resin composition. 
     
     
         6 . The resin composition according to  claim 3 , wherein
 the three-dimensional copolymer represented by the Formula 1 is generated by copolymerization of monomers represented by Formulas 3 to 5.   
       
         
           
           
               
               
           
         
       
     
     
         7 . The resin composition according to  claim 3 , wherein
 the three-dimensional copolymer represented by the Formula 2 is generated by copolymerization of monomers represented by Formulas 3, 4, and 6.   
       
         
           
           
               
               
           
         
       
     
     
         8 . The resin composition according to  claim 6 , wherein
 a reaction temperature of the copolymerization of the monomers represented by the Formulas 3 to 5 is 10 to 80° C.   
     
     
         9 . The resin composition according to  claim 7 , wherein
 a reaction temperature of the copolymerization of the monomers represented by the Formulas 3, 4, and 6 is 10 to 80° C.   
     
     
         10 . The resin composition according to  claim 1 , wherein the three-dimensional copolymer has a weight-average molecular weight of 5000 to 700000. 
     
     
         11 . The resin composition according to  claim 1 , wherein the resin composition has a viscosity of 200 to 1000 mPa·s. 
     
     
         12 . An electrical device using a cured product of the resin composition according to  claim 1  as an insulating material or a structural material.