Inventor · disambiguated record
Varughese Mathew
Also filed as: MATHEW VARUGHESE
32 granted patents·9 pending applications·203 citations·filing 2002–2024
96Inventor score
Files withFREESCALE SEMICONDUCTOR INC22MATHEW VARUGHESE8CHOPIN SHEILA F4NXP USA INC4CHATTERJEE RITWIK1
Top patents by PatentIndex Score
41 records- 0197US9012263B1Method for treating a bond pad of a package substrateMATHEW VARUGHESE·Filed 2013·Granted Apr 21, 2015·42 cites·20 claims
- 0293US9093383B1Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·7 cites·20 claims
- 0389US8836110B2Heat spreader for use within a packaged semiconductor deviceCHOPIN SHEILA F·Filed 2012·Granted Sep 16, 2014·13 cites·21 claims
- 0486US9640466B1Packaged semiconductor device with a lead frame and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 2, 2017·5 cites·20 claims
- 0585US6924232B2Semiconductor process and composition for forming a barrier material overlying copperFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 2, 2005·36 cites·20 claims
- 0683US8853867B2Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 7, 2014·6 cites·20 claims
- 0783US7422979B2Method of forming a semiconductor device having a diffusion barrier stack and structure thereofFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 9, 2008·14 cites·10 claims
- 0882US8168468B2Method of making a semiconductor device including a bridgeable materialMATHEW VARUGHESE·Filed 2008·Granted May 1, 2012·11 cites·20 claims
- 0982US7993971B2Forming a 3-D semiconductor die structure with an intermetallic formationFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 9, 2011·16 cites·12 claims
- 1081US10147697B1Bond pad structure for semiconductor device packagingNXP USA INC·Filed 2017·Granted Dec 4, 2018·3 cites·20 claims
- 1178US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 1278US7238601B2Semiconductor device having conductive spacers in sidewall regions and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jul 3, 2007·20 cites·20 claims
- 1375US8394713B2Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layerMATHEW VARUGHESE·Filed 2010·Granted Mar 12, 2013·4 cites·10 claims
- 1473US7572723B2Micropad for bonding and a method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 11, 2009·6 cites·18 claims
- 1570US8955388B2Mold compound compatibility test system and methods thereofMATHEW VARUGHESE·Filed 2012·Granted Feb 17, 2015·2 cites·20 claims
- 1663US7410544B2Method for cleaning electroless process tankFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 12, 2008·1 cites·19 claims
- 1762US7807572B2Micropad formation for a semiconductorFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·2 cites·20 claims
- 1861US8003517B2Method for forming interconnects for 3-D applicationsFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 23, 2011·2 cites·19 claims
- 1959US9508632B1Apparatus and methods for stackable packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Nov 29, 2016·1 cites·16 claims
- 2058US7932175B2Method to form a viaFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Apr 26, 2011·1 cites·36 claims
- 2158US2025316553A1Semiconductor device including a routable heat spreaderNXP USA INC·Filed 2024·Application pending·0 cites
- 2255US8586474B2Method to form a viaCHATTERJEE RITWIK·Filed 2011·Granted Nov 19, 2013·1 cites·20 claims
- 2355US7717060B2Controlled electroless platingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 18, 2010·1 cites·6 claims
- 2454US2024055415A1Package with mold-embedded inductor and method of fabrication thereforNXP USA INC·Filed 2022·Application pending·0 cites
- 2552US10199339B2Semiconductor structure with sacrificial anode and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 5, 2019·0 cites·19 claims
- 2651US9412709B2Semiconductor structure with sacrificial anode and passivation layer and method for formingCHOPIN SHEILA F·Filed 2013·Granted Aug 9, 2016·0 cites·15 claims
- 2750US10217713B2Semiconductor device attached to an exposed padNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·16 claims
- 2849US2008197497A1Barrier for use in 3-d integration of circuitsFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 2949US2016071787A1Semiconductor device attached to an exposed padCHOPIN SHEILA F·Filed 2014·Application pending·0 cites
- 3048US9426884B2System and method for lead frame package degatingCHOPIN SHEILA F·Filed 2013·Granted Aug 23, 2016·0 cites·20 claims
- 3148US6803323B2Method of forming a component overlying a semiconductor substrateFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 12, 2004·2 cites·17 claims
- 3248US2016064299A1Structure and method to minimize warpage of packaged semiconductor devicesLAKHERA NISHANT·Filed 2014·Application pending·0 cites
- 3347US7378339B2Barrier for use in 3-D integration of circuitsFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 27, 2008·0 cites·17 claims
- 3447US7176133B2Controlled electroless platingFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Feb 13, 2007·3 cites·29 claims
- 3546US9978614B2Structure and method to minimize warpage of packaged semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 22, 2018·0 cites·14 claims
- 3645US9117756B2Encapsulant with corrosion inhibitorMATHEW VARUGHESE·Filed 2012·Granted Aug 25, 2015·0 cites·18 claims
- 3744US2014367859A1Tin-based wirebond structuresFREESCALE SEMICONDUCTOR INC·Filed 2014·Application pending·0 cites
- 3842US2014242777A1Method for Bonding Semiconductor DevicesMATHEW VARUGHESE·Filed 2013·Application pending·0 cites
- 3941US9431313B1Integrated circuit carrier coatingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Aug 30, 2016·0 cites·20 claims
- 4039US2006270234A1Method and composition for preparing a semiconductor surface for deposition of a barrier materialMATHEW VARUGHESE·Filed 2005·Application pending·0 cites
- 4136US2007049008A1Method for forming a capping layer on a semiconductor deviceMARTIN GERALD A·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Varughese Mathew files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →