Inventor · disambiguated record
Yuancheng Christopher Pan
Also filed as: PAN YUANCHENG CHRISTOPHER
7 granted patents·7 pending applications·64 citations·filing 2009–2016
82Inventor score
Top patents by PatentIndex Score
14 records- 0194US8692368B2Integrated voltage regulator method with embedded passive device(s)PAN YUANCHENG CHRISTOPHER·Filed 2012·Granted Apr 8, 2014·30 cites·19 claims
- 0292US9048112B2Integrated voltage regulator with embedded passive device(s) for a stacked ICPAN YUANCHENG CHRISTOPHER·Filed 2010·Granted Jun 2, 2015·22 cites·18 claims
- 0383US9520358B2Via structure for optimizing signal porosityQUALCOMM INC·Filed 2015·Granted Dec 13, 2016·6 cites·14 claims
- 0472US9634486B2Dynamic power rail control for clusters of loadsQUALCOMM INC·Filed 2014·Granted Apr 25, 2017·3 cites·23 claims
- 0572US9585242B2Plane connected embedded substrate capacitorQUALCOMM INC·Filed 2014·Granted Feb 28, 2017·3 cites·20 claims
- 0653US9575095B2Low power high resolution oscillator based voltage sensorQUALCOMM INC·Filed 2014·Granted Feb 21, 2017·0 cites·35 claims
- 0753US2011050334A1Integrated Voltage Regulator with Embedded Passive Device(s)QUALCOMM INC·Filed 2009·Application pending·0 cites
- 0851US2013285696A1On-chip sensor for measuring dynamic power supply noise of the semiconductor chipQUALCOMM INC·Filed 2013·Application pending·0 cites
- 0947US2011215863A1Integrated Voltage Regulator with Embedded Passive Device(s)QUALCOMM INC·Filed 2011·Application pending·0 cites
- 1046US2010123215A1Capacitor Die Design for Small Form FactorsQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1144US9620452B2Via structure for optimizing signal porosityQUALCOMM INC·Filed 2016·Granted Apr 11, 2017·0 cites·16 claims
- 1244US2010327433A1High Density MIM Capacitor Embedded in a SubstrateQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1344US2016133614A1Semiconductor package with incorporated inductance elementQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1437US2012257618A1Method for Expanding a Single Chassis Network or Computing Platform Using Soft InterconnectsPAN YUANCHENG CHRISTOPHER·Filed 2012·Application pending·0 cites
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