Integrated Voltage Regulator with Embedded Passive Device(s)

Abstract

A semiconductor packaging system has a packaging substrate into which inductors and/or capacitors are partially or completely embedded. An active portion of a voltage regulator is mounted on the packaging substrate and supplies regulated voltage to a die also mounted on the packaging substrate. Alternatively, the active portion of the voltage regulator is integrated into the die the voltage regulator supplies voltage to. The voltage regulator cooperates with the inductors and/or capacitors to supply voltage to the die. The inductors may be through vias in the packaging substrate. For additional inductance, through vias in a printed circuit board on which the packaging substrate is mounted may couple to the through vias in the packaging substrate.

1 . A voltage regulator, comprising:
 a passive portion at least partially embedded in a packaging substrate; and   an active portion fabricated in a die coupled to the passive portion.   
     
     
         2 . The voltage regulator of  claim 1 , in which the passive portion comprises at least one capacitor. 
     
     
         3 . The voltage regulator of  claim 2 , in which the at least one capacitor is an embedded die. 
     
     
         4 . The voltage regulator of  claim 1 , in which the die is mounted on the packaging substrate. 
     
     
         5 . The voltage regulator of  claim 4 , further comprising:
 a second die mounted on the packaging substrate to which the active portion supplies voltage.   
     
     
         6 . The voltage regulator of  claim 1 , in which the passive portion comprises at least one inductor. 
     
     
         7 . The voltage regulator of  claim 6 , in which the passive portion further comprises at least one capacitor. 
     
     
         8 . The voltage regulator of  claim 6 , in which the at least one inductor comprises a first plurality of through vias in the packaging substrate. 
     
     
         9 . The voltage regulator of  claim 8 , in which the at least one inductor further comprises a second plurality of through vias in a printed circuit board that couples to the first plurality of through vias in the packaging substrate. 
     
     
         10 . The voltage regulator of  claim 9 , further comprising a coil that couples the second plurality of through vias. 
     
     
         11 . The voltage regulator of  claim 10 , in which the coil comprises an inductor coil mounted on a back side of the printed circuit board, the inductor coil wrapping a core. 
     
     
         12 . The voltage regulator of  claim 1 , integrated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. 
     
     
         13 . A method of supplying voltage to a die mounted on a packaging substrate, the method comprising:
 mounting an active portion of a voltage regulator on the packaging substrate; and   coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate; and   coupling the die to the at least one passive component.   
     
     
         14 . The method of  claim 13 , in which mounting the active portion of the voltage regulator comprises mounting the die on the packaging substrate, the die including the active portion of the voltage regulator. 
     
     
         15 . The method of  claim 13 , in which coupling the active portion of the voltage regulator to at least one passive component comprises coupling the active portion of the voltage regulator to at least one through via that provides inductance to the active portion of the voltage regulator. 
     
     
         16 . The method of  claim 13 , in which coupling the active portion of the voltage regulator to at least one passive component comprises:
 coupling the active portion of the voltage regulator to at least one capacitor at least partially embedded in the packaging substrate; and   coupling the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate.   
     
     
         17 . A method of supplying power to a die, the method comprising:
 providing a supply voltage to an active portion of a voltage regulator mounted on a packaging substrate mounted on a printed circuit board;   passing the supply voltage from the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate;   passing the supply voltage from the at least one inductor to at least one capacitor at least partially embedded in the packaging substrate; and   passing the supply voltage from the at least one capacitor to the die.   
     
     
         18 . The method of  claim 17 , in which passing the supply voltage to at least one inductor comprises passing the supply voltage to a first plurality of through vias in the packaging substrate. 
     
     
         19 . The method of  claim 18 , further comprising:
 passing the supply voltage from the first plurality of through vias in the packaging substrate to a second plurality of through vias in the printed circuit board; and   passing the supply voltage from the second plurality of through vias in the printed circuit board to the first plurality of through vias in the packaging substrate.   
     
     
         20 . A semiconductor packaging system, comprising:
 a packaging substrate into which at least one means for storing energy is at least partially embedded; and   means for regulating voltage mounted on the packaging substrate and cooperating with the energy storing means.   
     
     
         21 . The semiconductor packaging system of  claim 20 , further comprising:
 a first die mounted on the packaging substrate into which the voltage regulating means is integrated; and   a second die mounted on the packaging substrate, the second die receiving regulated voltage from the voltage regulating means.   
     
     
         22 . The semiconductor packaging system of  claim 20 , in which the energy storing means stores at least one of magnetic energy and electric energy.