Integrated Voltage Regulator with Embedded Passive Device(s)

Abstract

A method of supplying voltage to a die mounted on a packaging substrate includes mounting an active portion of a voltage regulator on the packaging substrate. The method also includes coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate and coupling the die to the at least one passive component. Mounting the active portion of the voltage regulator includes mounting the die on the packaging substrate where the die includes the active portion of the voltage regulator.

1 . A method of supplying voltage to a die mounted on a packaging substrate, the method comprising:
 mounting an active portion of a voltage regulator on the packaging substrate;   coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate; and   coupling the die to the at least one passive component.   
     
     
         2 . The method of  claim 1 , in which mounting the active portion of the voltage regulator comprises mounting the die on the packaging substrate, the die including the active portion of the voltage regulator. 
     
     
         3 . The method of  claim 1 , in which coupling the active portion of the voltage regulator to at least one passive component comprises coupling the active portion of the voltage regulator to at least one through via that provides inductance to the active portion of the voltage regulator. 
     
     
         4 . The method of  claim 1 , in which coupling the active portion of the voltage regulator to at least one passive component comprises:
 coupling the active portion of the voltage regulator to at least one capacitor at least partially embedded in the packaging substrate; and   coupling the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate.   
     
     
         5 . The method of  claim 1 , further comprising integrating the die into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. 
     
     
         6 . A method of supplying power to a die, the method comprising:
 providing a supply voltage to an active portion of a voltage regulator mounted on a packaging substrate mounted on a printed circuit board;   passing the supply voltage from the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate;   passing the supply voltage from the at least one inductor to at least one capacitor at least partially embedded in the packaging substrate; and   passing the supply voltage from the at least one capacitor to the die.   
     
     
         7 . The method of  claim 6 , in which passing the supply voltage to at least one inductor comprises passing the supply voltage to a first plurality of through vias in the packaging substrate. 
     
     
         8 . The method of  claim 7 , further comprising:
 passing the supply voltage from the first plurality of through vias in the packaging substrate to a second plurality of through vias in the printed circuit board; and   passing the supply voltage from the second plurality of through vias in the printed circuit board to the first plurality of through vias in the packaging substrate.   
     
     
         9 . The method of  claim 6 , further comprising integrating the die into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. 
     
     
         10 . A method of supplying voltage to a die mounted on a packaging substrate, the method comprising the steps of:
 mounting an active portion of a voltage regulator on the packaging substrate;   coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate; and   coupling the die to the at least one passive component.   
     
     
         11 . The method of  claim 10 , in which the step of mounting the active portion of the voltage regulator comprises the step of mounting the die on the packaging substrate, the die including the active portion of the voltage regulator. 
     
     
         12 . The method of  claim 10 , in which the step of coupling the active portion of the voltage regulator to at least one passive component comprises the step of coupling the active portion of the voltage regulator to at least one through via that provides inductance to the active portion of the voltage regulator. 
     
     
         13 . The method of  claim 10 , in which the step of coupling the active portion of the voltage regulator to at least one passive component comprises the steps of:
 coupling the active portion of the voltage regulator to at least one capacitor at least partially embedded in the packaging substrate; and   coupling the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate.   
     
     
         14 . The method of  claim 10 , further comprising the step of integrating the die into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer. 
     
     
         15 . A method of supplying power to a die, the method comprising the steps of:
 providing a supply voltage to an active portion of a voltage regulator mounted on a packaging substrate mounted on a printed circuit board;   passing the supply voltage from the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate;   passing the supply voltage from the at least one inductor to at least one capacitor at least partially embedded in the packaging substrate; and   passing the supply voltage from the at least one capacitor to the die.   
     
     
         16 . The method of  claim 15 , in which the step of passing the supply voltage to at least one inductor comprises the step of passing the supply voltage to a first plurality of through vias in the packaging substrate. 
     
     
         17 . The method of  claim 16 , further comprising the steps of:
 passing the supply voltage from the first plurality of through vias in the packaging substrate to a second plurality of through vias in the printed circuit board; and   passing the supply voltage from the second plurality of through vias in the printed circuit board to the first plurality of through vias in the packaging substrate.   
     
     
         18 . The method of  claim 15 , further comprising the step of integrating the die into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.