Inventor · disambiguated record
Cheng-Po Yu
Also filed as: YU CHENG-PO
42 granted patents·21 pending applications·110 citations·filing 2005–2018
97Inventor score
Top patents by PatentIndex Score
63 records- 0195US9635757B1Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Apr 25, 2017·17 cites·9 claims
- 0294US9514629B2Vehicle door opening warning system and vehicle door opening warning methodUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Dec 6, 2016·27 cites·8 claims
- 0392US9491865B1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 8, 2016·8 cites·4 claims
- 0486US8217278B2Embedded wiring board and a manufacturing method thereofYU CHENG-PO·Filed 2009·Granted Jul 10, 2012·12 cites·13 claims
- 0583US10433413B2Manufacturing method of circuit structure embedded with heat-dissipation blockUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Oct 1, 2019·5 cites·3 claims
- 0681US10616992B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Apr 7, 2020·2 cites·8 claims
- 0781US7745933B2Circuit structure and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 29, 2010·6 cites·16 claims
- 0875US8373071B2Embedded wiring board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Feb 12, 2013·4 cites·11 claims
- 0974US9084379B2Process for fabricating wiring boardCHEN TSUNG-YUAN·Filed 2012·Granted Jul 14, 2015·2 cites·13 claims
- 1073US7921550B2Process of fabricating circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Apr 12, 2011·3 cites·8 claims
- 1170US8288662B2Circuit structureTSENG TZYY-JANG·Filed 2010·Granted Oct 16, 2012·2 cites·12 claims
- 1270US7834274B2Multi-layer printed circuit board and method for fabricating the sameIND TECH RES INST·Filed 2006·Granted Nov 16, 2010·3 cites·16 claims
- 1369US10314179B2Manufacturing method of circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 4, 2019·1 cites·13 claims
- 1466US9159713B1Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Oct 13, 2015·2 cites·14 claims
- 1566US2014069574A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1665US10051748B2Circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 14, 2018·1 cites·6 claims
- 1764US8963019B2Manufacturing method of circuit boardYU CHENG-PO·Filed 2012·Granted Feb 24, 2015·2 cites·7 claims
- 1863US8987608B2Circuit structure and manufacturing method thereofHUANG SHANG-FENG·Filed 2012·Granted Mar 24, 2015·5 cites·11 claims
- 1962US8450621B2Wiring board and process for fabricating the sameCHEN TSUNG-YUAN·Filed 2008·Granted May 28, 2013·2 cites·4 claims
- 2062US8166652B2Method of making a circuit structure of a circuit boardYU CHENG-PO·Filed 2008·Granted May 1, 2012·2 cites·6 claims
- 2161US8598463B2Circuit board and manufacturing method thereofTSENG TZYY-JANG·Filed 2011·Granted Dec 3, 2013·0 cites·11 claims
- 2261US8436254B2Method of fabricating circuit board structureYU CHENG-PO·Filed 2011·Granted May 7, 2013·1 cites·15 claims
- 2361US7520755B2Method of forming solder mask and wiring board with solder maskUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Apr 21, 2009·1 cites·11 claims
- 2459US8171626B1Method for forming embedded circuitYU CHENG-PO·Filed 2011·Granted May 8, 2012·1 cites·16 claims
- 2559US7535098B2Structure of substrateUNIMICRON TECHNOLOGY CORP·Filed 2005·Granted May 19, 2009·1 cites·16 claims
- 2658US2010077610A1Method for manufacturing three-dimensional circuitUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2757US9805875B2Capacitor and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 31, 2017·0 cites·7 claims
- 2857US2016097130A1Preparation method of conductive sponge having effect of shielding electromagnetic waveUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 2956US2017229248A1Manufacturing method for capacitorUNIMICRON TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 3055US9883598B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 30, 2018·0 cites·4 claims
- 3155US9377596B2Optical-electro circuit board, optical component and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 28, 2016·0 cites·4 claims
- 3255US9210815B2Method of manufacturing embedded wiring boardYU CHENG-PO·Filed 2012·Granted Dec 8, 2015·0 cites·14 claims
- 3355US2011094778A1Circuit board and fabrication method thereofYU CHENG-PO·Filed 2009·Application pending·0 cites
- 3454US7867908B2Method of fabricating substrateUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jan 11, 2011·0 cites·15 claims
- 3554US2013040071A1Circuit board and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2012·Application pending·0 cites
- 3653US2016363974A1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Application pending·0 cites
- 3752US9739963B2Manufacturing method of optical componentUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 22, 2017·0 cites·3 claims
- 3851US9581774B2Optical-electro circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Feb 28, 2017·0 cites·6 claims
- 3951US8466369B2Circuit structure of circuit boardYU CHENG-PO·Filed 2011·Granted Jun 18, 2013·0 cites·6 claims
- 4051US2010044082A1Wiring boardUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 4151US2011023297A1Multi-layered printed circuit board and method for fabricating the sameIND TECHNOLOGY RES INST AND UNIMICRON TECHNOLOGY CORP·Filed 2010·Application pending·0 cites
- 4250US9335470B2Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 4350US9288917B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 15, 2016·0 cites·14 claims
- 4450US9131614B2Method of manufacturing an embedded wiring boardYU CHENG-PO·Filed 2012·Granted Sep 8, 2015·0 cites·9 claims
- 4550US9095083B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jul 28, 2015·0 cites·14 claims
- 4650US8979372B2Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·0 cites·15 claims
- 4749US9198303B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Nov 24, 2015·0 cites·16 claims
- 4849US2007151845A1Apparatus for forming metal filmCHANG CHIEH-KAI·Filed 2006·Application pending·0 cites
- 4949US2010006327A1Circuit board structureYU CHENG-PO·Filed 2008·Application pending·0 cites
- 5048US2016073505A1Manufacturing method of multilayer flexible circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →