Circuit board and method for manufacturing the same

Abstract

A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

What is claimed is: 
     
         1 . A circuit board with a heat-recovery function, comprising:
 a substrate;   a heat-storing device embedded in the substrate and connected to a processor for performing heat exchange with the processor; and   a thermoelectric device embedded in the substrate, comprising:
 a first metal-junction surface connected to the heat-storing device for performing heat exchange with the heat-storing device; and 
 a second metal-junction surface joined with the first metal-junction surface, wherein the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface. 
   
     
     
         2 . The circuit board of  claim 1 , further comprising:
 an interposer board disposed between the heat-storing device and the processor, the interposer board comprising:
 at least one via penetrating the interposer board; and 
 a heat-conducting pillar disposed in the via, wherein the heat-storing device performs heat exchange with the processor through the heat-conducting pillar. 
   
     
     
         3 . The circuit board of  claim 2 , wherein the substrate further comprises:
 a first opening disposed at a first surface of the substrate, wherein the heat-storing device is located in the first opening; and   a second opening disposed at a second surface of the substrate, wherein the first surface and the second surface are opposite to each other, the first opening and the second opening are opposite to and communicated with each other, and a width of the first opening is greater than a width of the second opening.   
     
     
         4 . The circuit board of  claim 2 , wherein the interposer board and the heat-storing device are arranged along a first direction, and the interposer board and the thermoelectric device are arranged along a second direction which is orthogonal to the first direction. 
     
     
         5 . The circuit board of  claim 2 , wherein the interposer board and the heat-storing device are arranged along a vertical direction, and the interposer board and the thermoelectric device are arranged along a horizontal direction. 
     
     
         6 . The circuit board of  claim 1 , wherein the heat-storing device further comprises:
 a housing;   a phase-change material, wherein the housing is filled with the phase-change material; and   at least one connecting pad disposed at the housing, wherein the first metal-junction surface of the thermoelectric device is connected to the phase-change material via the connecting pad.   
     
     
         7 . The circuit board of  claim 1 , further comprising:
 a heat-conducting unit disposed between the heat-storing device and the processor or between the heat-storing device and the thermoelectric device, wherein the heat-conducting unit is made of metal, graphene or combinations thereof.