Apparatus for forming metal film

Abstract

An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.

1 . An apparatus for forming a metal film on a substrate with at least one through-hole, comprising: 
 a sealed chamber, wherein the substrate is disposed within said sealed chamber and divide said sealed chamber into a first section and a second section;    a pressure generator, correspondingly connected to the first section of said sealed chamber, for pumping electrolyte to flow in parallel with the surface of the substrate; and    a pressure controller, correspondingly connected to the second section of said sealed chamber, for deriving the electrolyte and controlling the pressure difference between two sides of the substrate;    wherein the electrolyte is pumped by said pressure generator into said sealed chamber, flowing in the direction parallel to the surface of the substrate and flowing through the through-holes in the direction perpendicular to the substrate, and the thickness of the metal film grown in parallel with the surfaces of the substrate and the through-hole are uniformly formed.    
   
   
       2 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a electrolyte stabilizing device disposed between the substrate and said pressure generator, for stirring the electrolyte and stabilizing the quality of the electrolyte.  
   
   
       3 . The apparatus for forming a metal film as claimed in  claim 2 , wherein said electrolyte stabilizing device is a gas source for feeding a gas, so as to stir the electrolyte.  
   
   
       4 . The apparatus for forming a metal film as claimed in  claim 2 , wherein said electrolyte stabilizing device is a stirring device.  
   
   
       5 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a laminar flow stabilizing device disposed between said pressure generator and said sealed chamber, for changing the state of the fluid boundary layer of the electrolyte, such that the flow rate of the electrolyte flowing in parallel with the substrate is uniform and stable.  
   
   
       6 . The apparatus for forming a metal film as claimed in  claim 5 , wherein said laminar flow stabilizing device is a porous medium.  
   
   
       7 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising an electric field controller with two electrodes, wherein the two electrodes are immersed in the electrolyte and disposed on the two sides of the substrate respectively, so as to generate an electric field.  
   
   
       8 . The apparatus for forming a metal film as claimed in  claim 7 , wherein a direct current is applied between the two electrodes.  
   
   
       9 . The apparatus for forming a metal film as claimed in  claim 7 , wherein an alternating current is applied between the two electrodes.  
   
   
       10 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a temperature controller for controlling the temperature of the electrolyte.  
   
   
       11 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a flow rate controller disposed within said sealed chamber, wherein said flow rate controller moves relative to the substrate to adjust the space there-between, so as to control the flow rate of the electrolyte when flowing in parallel with the surface of the substrate.  
   
   
       12 . The apparatus for forming a metal film as claimed in  claim 1 , wherein said pressure generator is a liquid pump.  
   
   
       13 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a fluid feeding element disposed within said sealed chamber and connected to said pressure generator, and located on one side of the substrate, for guiding the electrolyte to be flowed in parallel with the surface of the substrate.  
   
   
       14 . The apparatus for forming a metal film as claimed in  claim 13 , wherein said fluid feeding element is shaped as a frame, with a circulating pipe disposed therein, and with a plurality of through holes located at an inner edge of the circulating pipe.  
   
   
       15 . The apparatus for forming a metal film as claimed in  claim 1 , wherein the substrate has a pattern formed with a catalyst, when the substrate is immersed in the electrolyte, an ion or a proton exchange is conducted between the electrolyte and the catalyst, forming the metal film with the pattern.  
   
   
       16 . The apparatus for forming a metal film as claimed in  claim 1 , further comprising a fluid deriving element disposed within said sealed chamber and connected to said pressure generation device, and located on one side of the substrate, for guiding the electrolyte to be flowed in parallel with the surface of the substrate.  
   
   
       17 . The apparatus for forming a metal film as claimed in  claim 16 , wherein said fluid deriving element is shaped as a frame, with a circulating pipe disposed therein, and with a plurality of through holes located at an inner edge of the circulating pipe.