Inventor · disambiguated record
Jae-Hyun Phee
Also filed as: PHEE JAE-HYUN
7 granted patents·6 pending applications·46 citations·filing 2009–2017
81Inventor score
Top patents by PatentIndex Score
13 records- 0188US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 0287US8575760B2Semiconductor devices having electrodesPHEE JAE-HYUN·Filed 2011·Granted Nov 5, 2013·21 cites·25 claims
- 0384US8492902B2Multi-layer TSV insulation and methods of fabricating the sameLEE HO-JIN·Filed 2011·Granted Jul 23, 2013·8 cites·14 claims
- 0471US8129840B2Semiconductor package and methods of manufacturing the sameJO CHAJEA·Filed 2009·Granted Mar 6, 2012·8 cites·19 claims
- 0551US2010105169A1Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2009·Application pending·0 cites
- 0642US2014145327A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0741US8778776B2Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the sameCHOI JU-IL·Filed 2011·Granted Jul 15, 2014·0 cites·16 claims
- 0840US8564102B2Semiconductor device having through silicon via (TSV)CHOI JU-IL·Filed 2011·Granted Oct 22, 2013·0 cites·12 claims
- 0938US2012292195A1Apparatus and method for electroplating for semiconductor substrateLEE UI HYOUNG·Filed 2012·Application pending·0 cites
- 1037US8586477B2Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor packageJEONG SE-YOUNG·Filed 2011·Granted Nov 19, 2013·0 cites·20 claims
- 1137US2018108540A1Method of forming an interposer and a method of manufacturing a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1236US2011226626A1Apparatus and method for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 1334US2012199981A1Semiconductor device and method of fabricating the semiconductor deviceJEONG SE-YOUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →