Apparatus and method for electroplating for semiconductor substrate

Abstract

An apparatus for electroplating a semiconductor device includes a plating bath accommodating a plating solution, and a paddle in the plating bath, the paddle including a plurality of holes configured to pass the plating solution through the paddle toward a substrate, and a plating solution flow reinforcement portion configured to selectively reinforce a flow of the plating solution to a predetermined area of the substrate, the predetermined area of the substrate being an area requiring a relatively increased supply of metal ions of the plating solution.

1 . An apparatus for electroplating a semiconductor device, the apparatus comprising:
 a plating bath accommodating a plating solution; and   a paddle in the plating bath, the paddle including:   a plurality of holes configured to pass the plating solution through the paddle toward a substrate, and   a plating solution flow reinforcement portion configured to selectively reinforce a flow of the plating solution to a predetermined area of the substrate, the predetermined area of the substrate being an area requiring a relatively increased supply of metal ions of the plating solution.   
     
     
         2 . The apparatus as claimed in  claim 1 , wherein the plating solution flow reinforcement portion is on the paddle and faces the substrate. 
     
     
         3 . The apparatus as claimed in  claim 2 , wherein the plating solution flow reinforcement portion includes at least one protrusion member protruding from the paddle toward the substrate. 
     
     
         4 . The apparatus as claimed in  claim 3 , wherein the plating solution flow reinforcement portion includes a plurality of the protrusion members, the protrusion members being separated from each other and arranged along a circumference of the paddle at a same radius. 
     
     
         5 . The apparatus as claimed in  claim 3 , wherein the at least one protrusion member is detachable, the protrusion member being a tab coupled to a corresponding hole of the plurality of holes in the paddle. 
     
     
         6 . The apparatus as claimed in  claim 5 , wherein the tab includes a male thread, the tab being coupled to the corresponding hole via a female thread on an inner surface of the hole. 
     
     
         7 . The apparatus as claimed in  claim 2 , wherein the plating solution flow reinforcement portion includes an insulation material. 
     
     
         8 . The apparatus as claimed in  claim 2 , wherein the plating solution flow reinforcement portion includes at least one groove recessed into a lower surface of the paddle. 
     
     
         9 . The apparatus as claimed in  claim 1 , further comprising an anode and a cathode in the plating bath, each of the anode and cathode being separated from the paddle, and the plating solution flow reinforcement portion being positioned in an electric field generated between the anode and cathode. 
     
     
         10 . The apparatus as claimed in  claim 9 , further comprising a linear flow guide portion on the anode, the linear flow guide portion being configured to linearly guide flow of the plating solution toward the paddle. 
     
     
         11 . The apparatus as claimed in  claim 10 , wherein the linear flow guide portion is a turbulence suppressor pad coupled to a groove on a surface of the anode, the turbulence suppressor pad having a shape corresponding to the groove. 
     
     
         12 . The apparatus as claimed in  claim 10 , wherein the linear flow guide portion is a porous media coupled to the anode. 
     
     
         13 . The apparatus as claimed in  claim 1 , further comprising a plating solution ejection member at an upper portion of the plating bath, the plating solution ejection member being configured to eject the plating solution from the upper portion of the plating bath toward a lower portion of the plating bath. 
     
     
         14 . An apparatus for electroplating a semiconductor device, the apparatus comprising:
 a plating bath accommodating a plating solution;   an anode and a cathode in the plating bath;   a paddle between the anode and cathode, the paddle being spaced apart from each of the anode and cathode, and the paddle including:   a plurality of holes configured to pass the plating solution through the paddle toward a substrate, the substrate being on the cathode, and   a plating solution flow reinforcement portion in an electric field generated between the anode and cathode, the plating solution reinforcement portion being positioned above a first area of the substrate, the first area of the substrate receiving a lower amount of the plating solution than a second area of the substrate when the electric field is not generated.   
     
     
         15 . The apparatus as claimed in  claim 14 , wherein the plating solution flow reinforcement portion is in the paddle, a shape of the plating solution flow reinforcement portion being configured to increase eddy flow in the first area of the substrate. 
     
     
         16 . A method of electroplating a semiconductor device, the method comprising:
 determining a predetermined area of a substrate requiring a relatively increased supply of metal ions of a plating solution;   providing a plating bath with a paddle, the paddle including:   a plurality of holes configured to pass the plating solution through the paddle toward the substrate, and   a plating solution flow reinforcement portion configured to selectively reinforce a flow of the plating solution in the predetermined area of the substrate;   installing the substrate in the plating bath; and   forming a plating film having a substantially uniform thickness on an entire surface of the substrate by supplying the plating solution to the plating bath and forming an electric field in the plating bath.   
     
     
         17 . The method as claimed in  claim 16 , wherein forming the electric field in the plating bath includes forming the plating solution flow reinforcement portion between an anode and a cathode in the plating bath. 
     
     
         18 . The method as claimed in  claim 16 , wherein providing the plating bath includes forming the plating solution flow reinforcement portion to include at least one protrusion member that protrudes from the paddle toward the substrate. 
     
     
         19 . The method as claimed in  claim 18 , wherein forming the plating solution flow reinforcement portion includes arranging a plurality of protrusion members along a circumference of the paddle at a same radius and separated from each other, the protrusion members including a plurality of tabs selectively coupled to the plurality of holes of the paddle to be detachable. 
     
     
         20 . The method as claimed in  claim 16 , wherein providing the plating bath includes forming the plating solution flow reinforcement portion to include at least one groove at a surface of the paddle to be recessed from the surface.