Inventor · disambiguated record
Shinichi Horiba
Also filed as: HORIBA SHINICHI
11 granted patents·3 pending applications·68 citations·filing 1997–2011
88Inventor score
Top patents by PatentIndex Score
14 records- 0160US6136696AMethod of forming a semiconductor device with a conductor plug including five dielectric layers, the fourth dielectric layer forming sidewall spacersNEC CORP·Filed 1999·Granted Oct 24, 2000·28 cites·5 claims
- 0256US8729642B2Semiconductor device comprising a gate electrode having an openingKITAMURA EIJI·Filed 2011·Granted May 20, 2014·1 cites·20 claims
- 0351US2009189248A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 0448US6580105B1Solid-state imaging deviceNEC ELECTRONICS CORP·Filed 1999·Granted Jun 17, 2003·12 cites·3 claims
- 0544US6861319B2Gate electrode and method of fabricating the sameELPIDA MEMORY INC·Filed 2003·Granted Mar 1, 2005·2 cites·7 claims
- 0641US5846878AMethod of manufacturing a wiring layer in a semiconductor deviceNEC CORP·Filed 1997·Granted Dec 8, 1998·10 cites·2 claims
- 0741US2003173582A1Solid-state imaging device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 0834US8395232B2Semiconductor device and method of manufacturing the sameHORIBA SHINICHI·Filed 2010·Granted Mar 12, 2013·0 cites·20 claims
- 0934US6150228AMethod of manufacturing an SRAM with increased resistance lengthNEC CORP·Filed 1998·Granted Nov 21, 2000·5 cites·8 claims
- 1034US5744866ALow resistance ground wiring in a semiconductor deviceNEC CORP·Filed 1997·Granted Apr 28, 1998·5 cites·12 claims
- 1132US6429478B1Semiconductor device which increases the capacity of a capacitor without deepening the contact holeNEC CORP·Filed 2000·Granted Aug 6, 2002·0 cites·12 claims
- 1232US6071785ALow resistance ground wiring in a semiconductor deviceNEC CORP·Filed 1997·Granted Jun 6, 2000·3 cites·12 claims
- 1332US2002130343A1Semiconductor device which increases the capacity without deepening the contact holeNEC CORP·Filed 2002·Application pending·0 cites
- 1430US5952724ASemiconductor device incorporating a stepped contact holeNEC CORP·Filed 1997·Granted Sep 14, 1999·2 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →