Inventor · disambiguated record
Kian Lee
Also filed as: LEE KIAN C · LEE KIAN CHAI · LEE KIAN S
14 granted patents·4 pending applications·463 citations·filing 2001–2006
94Inventor score
Top patents by PatentIndex Score
18 records- 0196US6583502B2Apparatus for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 24, 2003·110 cites·29 claims
- 0293US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0389US6787917B2Apparatus for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 7, 2004·45 cites·20 claims
- 0488US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0583US6787923B2Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masksMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·32 cites·29 claims
- 0681US7915718B2Apparatus for flip-chip packaging providing testing capabilityMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 29, 2011·29 cites·32 claims
- 0780US7005316B2Method for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 28, 2006·23 cites·16 claims
- 0876US7368391B2Methods for designing carrier substrates with raised terminalsMICRON TECHNOLOGY INC·Filed 2005·Granted May 6, 2008·8 cites·39 claims
- 0973US7320933B2Double bumping of flexible substrate for first and second level interconnectsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 22, 2008·15 cites·19 claims
- 1070US6656769B2Method and apparatus for distributing mold material in a mold for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 2, 2003·26 cites·7 claims
- 1165US7061124B2Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masksMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·10 cites·23 claims
- 1265US7018871B2Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 28, 2006·10 cites·27 claims
- 1350US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
- 1446US2006240595A1Method and apparatus for flip-chip packaging providing testing capabilityLEE TECK K·Filed 2006·Application pending·0 cites
- 1540US2004036170A1Double bumping of flexible substrate for first and second level interconnectsFiled 2002·Application pending·0 cites
- 1638US2007096133A1System and method for LED manufacturingLEE KIAN S·Filed 2005·Application pending·0 cites
- 1737US8084846B2Balanced semiconductor device packages including lead frame with floating leads and associated methodsLEE TECK KHENG·Filed 2006·Granted Dec 27, 2011·0 cites·25 claims
- 1832US2008025030A9Ceramic packaging for high brightness LED devicesLEE KONG W·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kian Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →