Assignee
LEE TECK KHENG
SG·12 granted patents·40 citations·filing 2005–2012
Top patents by PatentIndex Score
12 records- 0191US8125065B2Elimination of RDL using tape base flip chip on flex for die stackingLEE TECK KHENG·Filed 2007·Granted Feb 28, 2012·16 cites·33 claims
- 0286US8441113B2Elimination of RDL using tape base flip chip on flex for die stackingLEE TECK KHENG·Filed 2012·Granted May 14, 2013·6 cites·18 claims
- 0385US8269326B2Semiconductor device assembliesLEE TECK KHENG·Filed 2011·Granted Sep 18, 2012·6 cites·20 claims
- 0477US8174101B2Microelectronic devices and microelectronic support devices, and associated assemblies and methodsLEE TECK KHENG·Filed 2005·Granted May 8, 2012·7 cites·18 claims
- 0572US8604598B2Microelectronic devices and methods for manufacturing microelectronic devicesLEE TECK KHENG·Filed 2012·Granted Dec 10, 2013·2 cites·20 claims
- 0666US8101464B2Microelectronic devices and methods for manufacturing microelectronic devicesLEE TECK KHENG·Filed 2006·Granted Jan 24, 2012·2 cites·21 claims
- 0761US8310048B2Microelectronic devicesLEE TECK KHENG·Filed 2009·Granted Nov 13, 2012·1 cites·20 claims
- 0855US9412677B2Computer systems having an interposer including a flexible materialLEE TECK KHENG·Filed 2007·Granted Aug 9, 2016·0 cites·20 claims
- 0952US8436478B2Methods of fluxless micro-piercing of solder balls, and resulting devicesLEE TECK KHENG·Filed 2010·Granted May 7, 2013·0 cites·20 claims
- 1050US8778732B2Microelectronic devices and microelectronic support devices, and associated assemblies and methodsLEE TECK KHENG·Filed 2011·Granted Jul 15, 2014·0 cites·19 claims
- 1148US8283761B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesLEE TECK KHENG·Filed 2011·Granted Oct 9, 2012·0 cites·21 claims
- 1237US8084846B2Balanced semiconductor device packages including lead frame with floating leads and associated methodsLEE TECK KHENG·Filed 2006·Granted Dec 27, 2011·0 cites·25 claims
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