Inventor · disambiguated record
Ravi Mahajan
Also filed as: MAHAJAN RAVI · MAHAJAN RAVI V
35 granted patents·10 pending applications·1,304 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
45 records- 0199US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0298US8064224B2Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2008·Granted Nov 22, 2011·155 cites·20 claims
- 0396US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 0495US9941245B2Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrateSKEETE OSWALD·Filed 2007·Granted Apr 10, 2018·80 cites·10 claims
- 0595US6903929B2Two-phase cooling utilizing microchannel heat exchangers and channeled heat sinkINTEL CORP·Filed 2003·Granted Jun 7, 2005·111 cites·28 claims
- 0694US6934154B2Micro-channel heat exchangers and spreadersINTEL CORP·Filed 2003·Granted Aug 23, 2005·91 cites·30 claims
- 0794US6706562B2Electronic assembly with high capacity thermal spreader and methods of manufactureINTEL CORP·Filed 2001·Granted Mar 16, 2004·71 cites·23 claims
- 0893US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 0993US8441809B2Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2011·Granted May 14, 2013·14 cites·7 claims
- 1092US7851905B2Microelectronic package and method of cooling an interconnect feature in sameINTEL CORP·Filed 2007·Granted Dec 14, 2010·40 cites·16 claims
- 1192US5804771AOrganic substrate (PCB) slip plane "stress deflector" for flip chip deivcesINTEL CORP·Filed 1996·Granted Sep 8, 1998·111 cites·9 claims
- 1291US7882624B2Method of forming electronic package having fluid-conducting channelINTEL CORP·Filed 2006·Granted Feb 8, 2011·19 cites·20 claims
- 1391US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 1491US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 1590US7539016B2Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewallsINTEL CORP·Filed 2005·Granted May 26, 2009·17 cites·6 claims
- 1688US6191475B1Substrate for reducing electromagnetic interference and enclosureINTEL CORP·Filed 1997·Granted Feb 20, 2001·114 cites·23 claims
- 1784US7126822B2Electronic packages, assemblies, and systems with fluid coolingINTEL CORP·Filed 2003·Granted Oct 24, 2006·32 cites·29 claims
- 1883US11984396B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1982US12107042B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 2082US5936304AC4 package die backside coatingINTEL CORP·Filed 1997·Granted Aug 10, 1999·71 cites·28 claims
- 2181US6043983AEMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 1998·Granted Mar 28, 2000·47 cites·13 claims
- 2280US7508671B2Computer system having controlled coolingINTEL CORP·Filed 2003·Granted Mar 24, 2009·28 cites·3 claims
- 2379US6365441B1Partial underfill for flip-chip electronic packagesINTEL CORP·Filed 2000·Granted Apr 2, 2002·30 cites·18 claims
- 2478US7764499B2Electromagnetically-actuated micropump for liquid metal alloyINTEL CORP·Filed 2009·Granted Jul 27, 2010·6 cites·6 claims
- 2578US6908845B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2002·Granted Jun 21, 2005·29 cites·34 claims
- 2674US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 2768US6490166B1Integrated circuit package having a substrate vent holeINTEL CORP·Filed 1999·Granted Dec 3, 2002·30 cites·16 claims
- 2867US6700209B1Partial underfill for flip-chip electronic packagesINTEL CORP·Filed 1999·Granted Mar 2, 2004·33 cites·12 claims
- 2966US6239973B1EMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 2000·Granted May 29, 2001·12 cites·16 claims
- 3064US10796988B2Localized high density substrate routingINTEL CORP·Filed 2018·Granted Oct 6, 2020·0 cites·14 claims
- 3162US9941246B2Electronic assembly that includes stacked electronic devicesINTEL CORP·Filed 2014·Granted Apr 10, 2018·1 cites·7 claims
- 3260US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 3355US2005117300A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 3455US2005117299A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 3554US9820384B2Flexible electronic assembly methodINTEL CORP·Filed 2013·Granted Nov 14, 2017·0 cites·12 claims
- 3652US2009084931A1Enabling bare die liquid cooling for the bare die and hot spotsINTEL CORP·Filed 2007·Application pending·0 cites
- 3749USRE44629EProcess for assembling an integrated circuit package having a substrate vent holeRAMALINGAM SURESH·Filed 2004·Granted Dec 10, 2013·5 cites·16 claims
- 3848US6011696ACartridge and an enclosure for a semiconductor packageINTEL CORP·Filed 1998·Granted Jan 4, 2000·13 cites·19 claims
- 3948US2005117301A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 4047US7279796B2Microelectronic die having a thermoelectric moduleINTEL CORP·Filed 2003·Granted Oct 9, 2007·2 cites·9 claims
- 4145US2004190253A1Channeled heat sink and chassis with integrated heat rejector for two-phase coolingFiled 2003·Application pending·0 cites
- 4244US2015187681A1Flexible microelectronic assembly and methodMAHAJAN RAVI V·Filed 2013·Application pending·0 cites
- 4344US2006127672A1Method of providing a heat spreaderCHRYSLER GREGORY M·Filed 2006·Application pending·0 cites
- 4439US2003152773A1Diamond integrated heat spreader and method of manufacturing sameFiled 2002·Application pending·0 cites
- 4537US6173489B1Organic substrate (PCB) slip plane “stress deflector” for flip chip devicesINTEL CORP·Filed 1998·Granted Jan 16, 2001·5 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →