Enabling bare die liquid cooling for the bare die and hot spots

Abstract

A liquid cooling device for a die including a support block supporting a plurality of substantially vertical channels transporting fluid to and from a bare die surface for heat removal. The device is mounted on top of a bare die using a frame or spring. In another embodiment, the device allows thermoelectric cooling of a dedicated fluid line.

1 . A liquid cooling device for a die, the device comprising:
 a plurality of substantially vertical channels transporting fluid to and from a bare die surface, one or more of the channels comprising:
 an inlet portion transporting fluid to the bare die surface, 
 an outlet portion adjacent to the inlet portion and transporting fluid away from the bare die surface, 
 and a heat transfer region located between the inlet portion and the outlet portion, wherein fluid flowing through the heat transfer region directly contacts the bare die surface and removes heat from the bare die surface; 
   a support block capable of supporting the channels; and   a mechanism capable of attaching the support block to a substrate,   wherein a plurality of the channels are adjacent to each other.   
   
   
       2 . The liquid cooling device of  claim 1  further comprising one or more inlet pipes transporting fluid to the channels and one or more outlet pipes transporting fluid away from the channels. 
   
   
       3 . The liquid cooling device of  claim 2  wherein the inlet pipes are substantially parallel to the outlet pipes. 
   
   
       4 . The liquid cooling device of  claim 1  wherein the inlet portion and the outlet portion are separated by a wall. 
   
   
       5 . The liquid cooling device of  claim 1  wherein the heat transfer region is selectively positioned on the bare die surface. 
   
   
       6 . The liquid cooling device of  claim 5  wherein the heat transfer region is placed over a hot spot on the die. 
   
   
       7 . The liquid cooling device of  claim 1  wherein the channels cover a substantial area of the bare die surface. 
   
   
       8 . The liquid cooling device of  claim 1  wherein the channels are configured into a grid to separate flow. 
   
   
       9 . The liquid cooling device of  claim 1  wherein the mechanism comprises a spring coupling the support block to the substrate. 
   
   
       10 . The liquid cooling device of  claim 1  wherein the mechanism comprises epoxy for permanent attachment. 
   
   
       11 . The liquid cooling device of  claim 1  further comprising a thermoelectric cooling (TEC) device thermally coupled to one or more of the channels. 
   
   
       12 . A liquid cooling device for a die, the device comprising:
 a plurality of substantially vertical channels transporting fluid to and from a bare die surface, one or more of the channels comprising:
 an inlet portion transporting fluid to the bare die surface, 
 an outlet portion adjacent to the inlet portion and transporting fluid away from the bare die surface, 
 and a heat transfer region located between the inlet portion and the outlet portion, wherein fluid flowing through the heat transfer region directly contacts the bare die surface and removes heat from the bare die surface; 
   a support block capable of supporting the channels and coupling to a substrate; and   a dedicated fluid line routing fluid to a hot spot on the bare die surface.   
   
   
       13 . The liquid cooling device of  claim 12  wherein the dedicated fluid line is routed over a thermoelectric cooling (TEC) device. 
   
   
       14 . The liquid cooling device of  claim 13  wherein an outlet line of the dedicated fluid line is routed over a hot side of the TEC device and an inlet line of the dedicated fluid line is routed over a cold side of the TEC device. 
   
   
       15 . The liquid cooling device of  claim 12  wherein the dedicated fluid line comprises a vertical channel with a heat transfer region above the hot spot.