Assignee
MAHAJAN RAVI
US·2 granted patents·169 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0198US8064224B2Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2008·Granted Nov 22, 2011·155 cites·20 claims
- 0293US8441809B2Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2011·Granted May 14, 2013·14 cites·7 claims
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