Inventor · disambiguated record
Paul Smith
Also filed as: SMITH PAUL · SMITH PAUL F · SMITH PAUL FREDERICK
24 granted patents·6 pending applications·1,549 citations·filing 1993–2020
97Inventor score
Files withAPPLIED MATERIALS INC11MICRON TECHNOLOGY INC7PEARSON EDUCATION INC3HOSAGRAHARA ARVIND S2SMITH PAUL F2
Top patents by PatentIndex Score
30 records- 0198US7930160B1Electronic markup of executable modelsMATHWORKS INC·Filed 2006·Granted Apr 19, 2011·220 cites·49 claims
- 0298US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0397US7026238B2Reliability barrier integration for Cu applicationAPPLIED MATERIALS INC·Filed 2002·Granted Apr 11, 2006·99 cites·21 claims
- 0496US5983906AMethods and apparatus for a cleaning process in a high temperature, corrosive, plasma environmentAPPLIED MATERIALS INC·Filed 1997·Granted Nov 16, 1999·153 cites·27 claims
- 0596US5671141AComputer program architecture for onboard vehicle diagnostic systemFORD GLOBAL TECH INC·Filed 1993·Granted Sep 23, 1997·156 cites·17 claims
- 0695US6350320B1Heater for processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Feb 26, 2002·293 cites·28 claims
- 0791US6227141B1RF powered plasma enhanced chemical vapor deposition reactor and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·35 cites·35 claims
- 0890US6112697ARF powered plasma enhanced chemical vapor deposition reactor and methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 5, 2000·59 cites·26 claims
- 0986US6235646B1RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 2000·Granted May 22, 2001·16 cites·21 claims
- 1084US8336025B1Pattern modeling methods and systemsHOSAGRAHARA ARVIND S·Filed 2007·Granted Dec 18, 2012·17 cites·51 claims
- 1179US7355394B2Apparatus and method of dynamically measuring thickness of a layer of a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 8, 2008·9 cites·17 claims
- 1278US7112961B2Method and apparatus for dynamically measuring the thickness of an objectAPPLIED MATERIALS INC·Filed 2003·Granted Sep 26, 2006·18 cites·45 claims
- 1376US8519979B1Multi-point interface for a graphical modeling environmentSMITH PAUL F·Filed 2006·Granted Aug 27, 2013·8 cites·41 claims
- 1475US10705687B1Visually indicating on a user interface lengths, types of content, structure and current user location within a corpus of electronic contentPEARSON EDUCATION INC·Filed 2019·Granted Jul 7, 2020·2 cites·20 claims
- 1575US8525813B1Multi-point interface for a graphical modeling environmentSMITH PAUL F·Filed 2007·Granted Sep 3, 2013·7 cites·24 claims
- 1672US8776015B1Pattern modeling methods and systemsHOSAGRAHARA ARVIND S·Filed 2007·Granted Jul 8, 2014·7 cites·22 claims
- 1772US6705246B2RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·7 cites·25 claims
- 1868US6893548B2Method of conditioning electrochemical baths in plating technologyAPPLIED MATERIALS INC·Filed 2001·Granted May 17, 2005·5 cites·8 claims
- 1965US6533894B2RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 18, 2003·4 cites·25 claims
- 2063US7777483B2Method and apparatus for measuring a thickness of a layer of a waferAPPLIED MATERIALS INC·Filed 2008·Granted Aug 17, 2010·3 cites·19 claims
- 2160US6159867ARF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 12, 2000·14 cites·17 claims
- 2259US2010098882A1Plasma source for chamber cleaning and processAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 2357USD918254SDisplay screen with graphical user interfacePEARSON EDUCATION INC·Filed 2019·Granted May 4, 2021·8 cites·1 claims
- 2457US6753248B1Post metal barrier/adhesion filmAPPLIED MATERIALS INC·Filed 2003·Granted Jun 22, 2004·7 cites·21 claims
- 2555US2007151861A1Reliability barrier integration for cu applicationXI MING·Filed 2007·Application pending·0 cites
- 2654US2020293162A1Visually indicating on a user interface lengths, types of content, structure and current user location within a corpus of electronic contentPEARSON EDUCATION INC·Filed 2020·Application pending·0 cites
- 2744US2004209460A1Reliability barrier integration for Cu applicationFiled 2004·Application pending·0 cites
- 2838US2018130639A1External plasma systemVRANICH MICHAEL NICHOLAS·Filed 2016·Application pending·0 cites
- 2937US2003116427A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3036US6395128B2RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor depositionMICRON TECHNOLOGY INC·Filed 1998·Granted May 28, 2002·3 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →