Inventor · disambiguated record
Bruce M. Mcwilliams
Also filed as: MCWILLIAMS BRUCE · MCWILLIAMS BRUCE M · MCWILLIAMS BRUCE MARSHALL
13 granted patents·5 pending applications·190 citations·filing 1990–2017
92Inventor score
Top patents by PatentIndex Score
18 records- 0196US7298030B2Structure and method of making sealed capped chipsTESSERA INC·Filed 2004·Granted Nov 20, 2007·75 cites·5 claims
- 0295US7566853B2Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architectureTESSERA INC·Filed 2005·Granted Jul 28, 2009·45 cites·25 claims
- 0388US8988759B2Metamaterial surfacesBOWERS JEFFREY A·Filed 2010·Granted Mar 24, 2015·7 cites·58 claims
- 0486US9099786B2Metamaterial surfacesBOWERS JEFFREY A·Filed 2010·Granted Aug 4, 2015·6 cites·27 claims
- 0584US9698558B2Method and system for pumping of an optical resonatorELWHA LLC·Filed 2016·Granted Jul 4, 2017·2 cites·20 claims
- 0683US9105978B2Metamaterial surfacesBOWERS JEFFREY A·Filed 2010·Granted Aug 11, 2015·5 cites·50 claims
- 0774US6589819B2Microelectronic packages having an array of resilient leads and methods thereforTESSERA INC·Filed 2001·Granted Jul 8, 2003·21 cites·43 claims
- 0871US6891255B2Microelectronic packages having an array of resilient leadsTESSERA INC·Filed 2003·Granted May 10, 2005·17 cites·7 claims
- 0962US10199793B2Method and system for pumping of an optical resonatorELWHA LLC·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 1062US9385503B2Method and system for pumping of an optical resonatorELWHA LLC·Filed 2015·Granted Jul 5, 2016·0 cites·35 claims
- 1157US9048621B2Method and system for pumping of an optical resonatorELWHA LLC·Filed 2013·Granted Jun 2, 2015·0 cites·37 claims
- 1253US2008032457A1Structure and method of making sealed capped chipsTESSERA INC·Filed 2007·Application pending·0 cites
- 1352US2007096311A1Structure and method of making capped chips having vertical interconnectsTESSERA INC·Filed 2006·Application pending·0 cites
- 1450US9105979B2Metamaterial surfacesBOWERS JEFFREY A·Filed 2010·Granted Aug 11, 2015·0 cites·47 claims
- 1545US2007138644A1Structure and method of making capped chip having discrete article assembled into vertical interconnectTESSERA INC·Filed 2005·Application pending·0 cites
- 1644US2006081983A1Wafer level microelectronic packaging with double isolationHUMPSTON GILES·Filed 2004·Application pending·0 cites
- 1742US2008036100A1Solder elements with columnar structures and methods of making the sameTESSERA INC·Filed 2006·Application pending·0 cites
- 1841US5214844AMethod of assembling integrated circuits to a silicon boardNCHIP INC·Filed 1990·Granted Jun 1, 1993·12 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →