Inventor · disambiguated record
Joungin Yang
Also filed as: YANG JOUNGIN
17 granted patents·3 pending applications·193 citations·filing 2006–2014
94Inventor score
Top patents by PatentIndex Score
20 records- 0196US7312519B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 25, 2007·50 cites·5 claims
- 0292US8035210B2Integrated circuit package system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Oct 11, 2011·27 cites·20 claims
- 0392US7298037B2Stacked integrated circuit package-in-package system with recessed spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·27 cites·15 claims
- 0490US7482203B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 27, 2009·18 cites·20 claims
- 0588US7901987B2Package-on-package system with internal stacking module interposerSTATS CHIPPAC LTD·Filed 2008·Granted Mar 8, 2011·19 cites·20 claims
- 0684US7986048B2Package-on-package system with through vias and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jul 26, 2011·7 cites·5 claims
- 0783US9281228B2Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor dieCHOI DAESIK·Filed 2011·Granted Mar 8, 2016·7 cites·32 claims
- 0882US8598034B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2012·Granted Dec 3, 2013·4 cites·9 claims
- 0978US8710640B2Integrated circuit packaging system with heat slug and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Apr 29, 2014·5 cites·18 claims
- 1077US9406579B2Semiconductor device and method of controlling warpage in semiconductor packageCHOI DAESIK·Filed 2012·Granted Aug 2, 2016·5 cites·27 claims
- 1177US9245772B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2014·Granted Jan 26, 2016·4 cites·23 claims
- 1276US9390945B2Semiconductor device and method of depositing underfill material with uniform flow rateLEE KYUNGHOON·Filed 2012·Granted Jul 12, 2016·4 cites·26 claims
- 1375US7800211B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2007·Granted Sep 21, 2010·8 cites·17 claims
- 1467US9142481B2Integrated circuit packaging system with heatsink cap and method of manufacture thereofKIM GWANGJIN·Filed 2012·Granted Sep 22, 2015·4 cites·9 claims
- 1560US8476775B2Integrated circuit packaging system with embedded interconnect and method of manufacture thereofYANG JOUNGIN·Filed 2009·Granted Jul 2, 2013·4 cites·20 claims
- 1644US9401289B2Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfacesKIM MINJUNG·Filed 2012·Granted Jul 26, 2016·0 cites·14 claims
- 1744US7804166B2Integrated circuit package system with stacking moduleSTATS CHIPPAC LTD·Filed 2008·Granted Sep 28, 2010·0 cites·20 claims
- 1843US2011024890A1Stackable Package By Using Internal Stacking ModulesSTATS CHIPPAC LTD·Filed 2010·Application pending·0 cites
- 1939US2013328220A1Integrated circuit packaging system with film assist and method of manufacture thereofLEE KYUNGHOON·Filed 2012·Application pending·0 cites
- 2037US2013113118A1Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning LayerKIM MINJUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →