Assignee
LEE KYUNGHOON
KR·7 granted patents·1 pending application·64 citations·filing 2009–2013
Top patents by PatentIndex Score
8 records- 0195US8399300B2Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill materialLEE KYUNGHOON·Filed 2010·Granted Mar 19, 2013·38 cites·27 claims
- 0286US8421201B2Integrated circuit packaging system with underfill and methods of manufacture thereofLEE KYUNGHOON·Filed 2009·Granted Apr 16, 2013·13 cites·16 claims
- 0378US8877567B2Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor dieLEE KYUNGHOON·Filed 2010·Granted Nov 4, 2014·7 cites·17 claims
- 0476US9390945B2Semiconductor device and method of depositing underfill material with uniform flow rateLEE KYUNGHOON·Filed 2012·Granted Jul 12, 2016·4 cites·26 claims
- 0562US9053953B1Integrated circuit packaging system with underfill and method of manufacture thereofLEE KYUNGHOON·Filed 2013·Granted Jun 9, 2015·1 cites·20 claims
- 0658US10096540B2Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distanceLEE KYUNGHOON·Filed 2011·Granted Oct 9, 2018·1 cites·4 claims
- 0743US8853855B2Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereofLEE KYUNGHOON·Filed 2012·Granted Oct 7, 2014·0 cites·9 claims
- 0839US2013328220A1Integrated circuit packaging system with film assist and method of manufacture thereofLEE KYUNGHOON·Filed 2012·Application pending·0 cites
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