Inventor · disambiguated record
Mark C. Lamorey
Also filed as: LAMOREY MARK · LAMOREY MARK C · LAMOREY MARK C H · LAMOREY MARK CURTIS HAYES
26 granted patents·112 citations·filing 2006–2019
95Inventor score
Top patents by PatentIndex Score
26 records- 0195US9209141B2Shielded package assemblies with integrated capacitorIBM·Filed 2014·Granted Dec 8, 2015·13 cites·17 claims
- 0294US9059127B1Packages for three-dimensional die stacksIBM·Filed 2014·Granted Jun 16, 2015·15 cites·13 claims
- 0393US9190399B2Thermally enhanced three-dimensional integrated circuit packageIBM·Filed 2014·Granted Nov 17, 2015·16 cites·20 claims
- 0491US11049819B2Shielded package assemblies with integrated capacitorIBM·Filed 2019·Granted Jun 29, 2021·4 cites·17 claims
- 0589US9935058B2Shielded package assemblies with integrated capacitorIBM·Filed 2016·Granted Apr 3, 2018·4 cites·17 claims
- 0688US9531209B2Shielded package assemblies with integrated capacitorIBM·Filed 2015·Granted Dec 27, 2016·4 cites·13 claims
- 0786US7260004B2Method and apparatus for increasing yield in a memory circuitIBM·Filed 2006·Granted Aug 21, 2007·15 cites·19 claims
- 0882US10553544B2Shielded package assemblies with integrated capacitorIBM·Filed 2017·Granted Feb 4, 2020·2 cites·10 claims
- 0982US9543255B2Reduced-warpage laminate structureIBM·Filed 2016·Granted Jan 10, 2017·3 cites·1 claims
- 1081US9018040B2Power distribution for 3D semiconductor packageIBM·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 1179US8952503B2Organic module EMI shielding structures and methodsIBM·Filed 2013·Granted Feb 10, 2015·4 cites·8 claims
- 1277US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 1375US9078373B1Integrated circuit structures having off-axis in-hole capacitor and methods of formingIBM·Filed 2014·Granted Jul 7, 2015·2 cites·9 claims
- 1473US9613915B2Reduced-warpage laminate structureIBM·Filed 2014·Granted Apr 4, 2017·2 cites·16 claims
- 1573US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 1670US9245083B2Method, structures and method of designing reduced delamination integrated circuitsLAMOREY MARK C H·Filed 2011·Granted Jan 26, 2016·4 cites·22 claims
- 1766US9599664B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresIBM·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 1865US9543254B2Chamfered corner crackstop for an integrated circuit chipGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 10, 2017·1 cites·6 claims
- 1964US9245854B2Organic module EMI shielding structures and methodsIBM·Filed 2014·Granted Jan 26, 2016·1 cites·18 claims
- 2064US7505337B2Method and apparatus for repairing a shorted tunnel deviceIBM·Filed 2006·Granted Mar 17, 2009·5 cites·20 claims
- 2162US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 2255US10685919B2Reduced-warpage laminate structureIBM·Filed 2017·Granted Jun 16, 2020·0 cites·9 claims
- 2354US9185807B2Integrated circuit structures having off-axis in-hole capacitorIBM·Filed 2015·Granted Nov 10, 2015·0 cites·11 claims
- 2452US8999846B2Elongated via structuresIBM·Filed 2014·Granted Apr 7, 2015·0 cites·18 claims
- 2552US7352639B2Method and apparatus for increasing yield in a memory circuitIBM·Filed 2007·Granted Apr 1, 2008·2 cites·15 claims
- 2642US9059191B2Chamfered corner crackstop for an integrated circuit chipLAMOREY MARK C·Filed 2011·Granted Jun 16, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →