Assignee
LACROIX LUKE D
US·4 granted patents·10 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0177US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 0273US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 0362US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 0462US8586982B2Semiconductor test chip device to mimic field thermal mini-cycles to assess reliabilityLACROIX LUKE D·Filed 2010·Granted Nov 19, 2013·1 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →