Inventor · disambiguated record
Wei-Shun Wang
Also filed as: WANG WEI-SHUN
26 granted patents·4 pending applications·622 citations·filing 2007–2024
96Inventor score
Files withTESSERA INC9INVENSAS CORP5CHAU ELLIS3ADEIA SEMICONDUCTOR SOLUTIONS LLC2ADEIA SEMICONDUCTOR TECH LLC2
Top patents by PatentIndex Score
30 records- 0198US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 0298US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0398US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 0498US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 0598US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 0698US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 0798US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 0897US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 0992US9137903B2Semiconductor chip assembly and method for making sameKANG TECK-GYU·Filed 2011·Granted Sep 15, 2015·13 cites·20 claims
- 1092US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1191US10062661B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2017·Granted Aug 28, 2018·5 cites·14 claims
- 1289US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 1385US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1485US11424211B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA LLC·Filed 2020·Granted Aug 23, 2022·1 cites·29 claims
- 1578US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1678US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 1777US10593643B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2018·Granted Mar 17, 2020·1 cites·14 claims
- 1875US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1973US8299626B2Microelectronic packageMOHAMMED ILYAS·Filed 2007·Granted Oct 30, 2012·5 cites·4 claims
- 2072US12494453B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 2172US10833044B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 2270US9691731B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 2362US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 2462US2025385153A1Thermal management systems and methods for semiconductor devicesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 2561US10163808B2Module with embedded side shield structures and method of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Dec 25, 2018·1 cites·10 claims
- 2660US9865479B2Method of attaching components to printed cirucuit board with reduced accumulated tolerancesAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jan 9, 2018·1 cites·20 claims
- 2752US9716075B2Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2015·Granted Jul 25, 2017·0 cites·11 claims
- 2852US2017309593A1Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2017·Application pending·0 cites
- 2951US2024146257A1Radio frequency power amplifier module using cavity and submodule technologiesAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 3049US9349672B2Microelectronic packageTESSERA INC·Filed 2012·Granted May 24, 2016·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →